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Journal Articles

Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

Available to Purchase
Z. Guo, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 159–164.
https://doi.org/10.1115/1.2909312
Published Online: June 1, 1993
View Articletitled, Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
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Topics: Fatigue cracks, Solder joints, Shear (Mechanics), Solders, Intermetallic compounds, Metals, Preferences, Temperature
Journal Articles

Mechanical Behavior of Flip-Chip Encapsulants

Available to Purchase
E. Suhir, J. M. Segelken
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 327–332.
https://doi.org/10.1115/1.2904385
Published Online: December 1, 1990
View Articletitled, Mechanical Behavior of Flip-Chip Encapsulants
Open the PDF for Mechanical Behavior of Flip-Chip Encapsulants in another window
Topics: Flip-chip, Mechanical behavior, Stress, Design, Epoxy adhesives, Epoxy resins, Silicones, Failure, Mechanical properties, Preferences