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Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Available to Purchase
Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Articletitled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

Available to Purchase
J. A. Swanson, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
https://doi.org/10.1115/1.2793857
Published Online: December 1, 1999
View Articletitled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model