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Journal Articles

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

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Joshua Kasitz, Muhammad Ghufran, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041120.
Paper No: EP-24-1041
https://doi.org/10.1115/1.4066480
Published Online: September 30, 2024
View Articletitled, Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
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Topics: Composite materials, Phase change materials, Silicones, Temperature, Particulate matter, Testing, Cooling, Insulation, Needles, Latent heat
Journal Articles

Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials

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Jiawei Chen, Zhongming Yan, Yang Qiao, Feihong Lin, Yu Wang, Hongcheng Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021011.
Paper No: EP-23-1062
https://doi.org/10.1115/1.4064099
Published Online: December 11, 2023
View Articletitled, Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials
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Topics: Energy dissipation, Heat, Topology optimization, Design, Density, Temperature, Topology, Phase change materials
Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

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Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Articletitled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

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Justin Hollis, Darin J. Sharar, Todd Bandhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
https://doi.org/10.1115/1.4052669
Published Online: November 5, 2021
View Articletitled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities
Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

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Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
https://doi.org/10.1115/1.4052074
Published Online: September 24, 2021
View Articletitled, Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model
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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

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John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
View Articletitled, A Review on Transient Thermal Management of Electronic Devices
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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

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H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
View Articletitled, A System to Package Perspective on Transient Thermal Management of Electronics
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Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat
Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

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Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
https://doi.org/10.1115/1.4047497
Published Online: June 26, 2020
View Articletitled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
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Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection
Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

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Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
https://doi.org/10.1115/1.4046935
Published Online: May 4, 2020
View Articletitled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
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Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat
Journal Articles

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

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Thomas H. Sherer, II, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031008.
Paper No: EP-16-1014
https://doi.org/10.1115/1.4034101
Published Online: July 28, 2016
View Articletitled, Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit
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Topics: Data centers, Flow (Dynamics), Temperature, Water, Computer simulation, Shells, Temperature profiles, Phase change materials, Cooling, Thermal energy storage
Journal Articles

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

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Sandesh S. Chougule, S. K. Sahu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021004.
Paper No: EP-14-1024
https://doi.org/10.1115/1.4028994
Published Online: June 1, 2015
View Articletitled, Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling
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Topics: Computer cooling, Cooling, Heat pipes, Nanofluids, Phase change materials, Water, Temperature, Paraffin wax, Heating, Test facilities
Journal Articles

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

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Mustapha Faraji, Hamid El Qarnia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
https://doi.org/10.1115/1.3103953
Published Online: April 3, 2009
View Articletitled, Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
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Topics: Cooling, Electronic components, Heat, Heat conduction, Heat transfer, Melting, Rayleigh number, Temperature, Phase change materials, Heat sinks
Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

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K. Lafdi, O. Mesalhy, A. Elgafy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
https://doi.org/10.1115/1.2912185
Published Online: April 25, 2008
View Articletitled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
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Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity
Journal Articles

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

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Shankar Krishnan, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
https://doi.org/10.1115/1.1772411
Published Online: October 6, 2004
View Articletitled, Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?
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Topics: Copper, Heat sinks, Junctions, Melting, Phase change materials, Temperature, Thermal conductivity, Transients (Dynamics), Thermal management, Energy storage
Journal Articles

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

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Suman Chakraborty, Pradip Dutta, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 126–133.
https://doi.org/10.1115/1.1535445
Published Online: March 14, 2003
View Articletitled, Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging
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Topics: Freezing, Heat transfer, Melting, Packaging, Solidification, Temperature distribution, Phase change materials, Convection
Journal Articles

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

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Marc Hodes, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, Calvin Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
https://doi.org/10.1115/1.1523061
Published Online: December 12, 2002
View Articletitled, Transient Thermal Management of a Handset Using Phase Change Material (PCM)
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Topics: Heat transfer, Natural convection, Phase change materials, Steady state, Temperature, Thermal management, Transients (Dynamics), Radiation (Physics), Thermocouples, Heat
Journal Articles

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

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A. G. Evans, M. Y. He, J. W. Hutchinson, M. Shaw
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 211–217.
https://doi.org/10.1115/1.1370376
Published Online: October 1, 2000
View Articletitled, Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses
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Topics: Electronics, Melting, Steady state, Temperature, Transients (Dynamics), Junctions, Design, Temperature distribution, Phase change materials
Journal Articles

Avionics Passive Cooling With Microencapsulated Phase Change Materials

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A. J. Fossett, M. T. Maguire, A. A. Kudirka, F. E. Mills, D. A. Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 238–242.
https://doi.org/10.1115/1.2792628
Published Online: September 1, 1998
View Articletitled, Avionics Passive Cooling With Microencapsulated Phase Change Materials
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Topics: Avionics, Cooling, Phase change materials, Aircraft, Aluminum plate, Design, Heat sinks, Missiles, Weight (Mass)
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

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D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Articletitled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy