1-20 of 70
Particulate matter
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm

Available to Purchase
Accepted Manuscript
Miao Zhu, Xuexia Yang, Yanxi Sun, Jinbao Lin, Erqiang Liu, Ze Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1084
https://doi.org/10.1115/1.4068450
Published Online: April 17, 2025
View Articletitled, Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm
Open the PDF for Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm in another window
Topics: Algorithms, Ball-Grid-Array packaging, Optimization, Particulate matter, Random vibration, Reliability, Solder joints, Stress, Ball-Grid-Array packages, Simulation
Journal Articles

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Available to Purchase
Joshua Kasitz, Muhammad Ghufran, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041120.
Paper No: EP-24-1041
https://doi.org/10.1115/1.4066480
Published Online: September 30, 2024
View Articletitled, Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
Open the PDF for Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation in another window
Topics: Composite materials, Phase change materials, Silicones, Temperature, Particulate matter, Testing, Cooling, Insulation, Needles, Latent heat
Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

Available to Purchase
Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
https://doi.org/10.1115/1.4065939
Published Online: August 9, 2024
View Articletitled, Electrically Conductive Adhesives in Microelectronics Packaging
Open the PDF for Electrically Conductive Adhesives in Microelectronics Packaging in another window
Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter
Journal Articles

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

Available to Purchase
Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031005.
Paper No: EP-23-1069
https://doi.org/10.1115/1.4064704
Published Online: February 28, 2024
View Articletitled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
Open the PDF for Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform in another window
Topics: Errors, Kinematics, Packaging, Particle swarm optimization, Artificial neural networks, Design, Particulate matter, Trajectories (Physics), Simulation, Displacement
Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Free
Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Articletitled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
Open the PDF for The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch in another window
Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Journal Articles

Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure

Available to Purchase
Zong-Tao Li, Jun-Hao Wu, Guan-Wei Liang, Ren-peng Yang, Zhihui Yang, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011001.
Paper No: EP-22-1071
https://doi.org/10.1115/1.4062383
Published Online: May 2, 2023
View Articletitled, Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure
Open the PDF for Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure in another window
Topics: Columns (Structural), Particulate matter, Reflectance
Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Available to Purchase
Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Articletitled, Effective Constitutive Relations for Sintered Nano Copper Joints
Open the PDF for Effective Constitutive Relations for Sintered Nano Copper Joints in another window
Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Available to Purchase
Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Articletitled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
Open the PDF for Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids in another window
Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Available to Purchase
Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Articletitled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Open the PDF for Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Available to Purchase
Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
https://doi.org/10.1115/1.4051728
Published Online: September 15, 2021
View Articletitled, Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
Open the PDF for Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds in another window
Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper
Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Available to Purchase
Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
https://doi.org/10.1115/1.4051255
Published Online: September 15, 2021
View Articletitled, Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
Open the PDF for Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review in another window
Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Available to Purchase
Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Articletitled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
Open the PDF for Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds in another window
Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Available to Purchase
Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041005.
Paper No: EP-20-1011
https://doi.org/10.1115/1.4048729
Published Online: October 28, 2020
View Articletitled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
Open the PDF for Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior in another window
Topics: Algorithms, Particulate matter, Optimization, Network models
Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Available to Purchase
Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
https://doi.org/10.1115/1.4047469
Published Online: June 23, 2020
View Articletitled, Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization
Open the PDF for Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization in another window
Topics: Data centers, Dust, Leakage, Particulate matter, Sensors
Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Available to Purchase
Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
https://doi.org/10.1115/1.4046935
Published Online: May 4, 2020
View Articletitled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
Open the PDF for Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications in another window
Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Available to Purchase
Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Articletitled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
Open the PDF for High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting in another window
Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Available to Purchase
Jimil M. Shah, Abel Misrak, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
https://doi.org/10.1115/1.4043481
Published Online: May 8, 2019
View Articletitled, Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
Open the PDF for Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization in another window
Topics: Data centers, Fourier transform infrared spectroscopy, Particulate matter, Scanning electron microscopy, Contamination, Dust
Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Available to Purchase
Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
View Articletitled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Open the PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging in another window
Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Available to Purchase
Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Articletitled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
Open the PDF for Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density in another window
Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Available to Purchase
Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Articletitled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
Open the PDF for Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model in another window
Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties