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Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Article titled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
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Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

Chuen-Ching Wang, Wen-Ran Yang, Jin-Jia Chen, Wei-Wen Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041002.
https://doi.org/10.1115/1.4000207
Published Online: October 21, 2009
View Article titled, A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks
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Topics: Design, Flip-chip, Lenses (Optics), Optical fiber
Journal Articles

Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

Z. W. Zhong, S. C. Lim, A. Asundi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
https://doi.org/10.1115/1.1846063
Published Online: March 21, 2005
View Article titled, Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging
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Topics: Epoxy adhesives, Fibers, Finite element analysis, Optical fiber, Shear (Mechanics), Silicon, Temperature, MEMS packaging, Epoxy resins
Journal Articles

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 391–396.
https://doi.org/10.1115/1.2056573
Published Online: December 14, 2004
View Article titled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
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Topics: Algorithms, Laser beams, Optical fiber, Simulated annealing, Uncertainty, Temperature, Lasers
Journal Articles

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

E. Suhir, Fellow ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
https://doi.org/10.1115/1.1569510
Published Online: June 10, 2003
View Article titled, Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review
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Topics: Modeling, Stress, Thermal stresses, Finite element analysis, Photonics, Thermal expansion, Design, Microelectronic devices, Optical fiber, Manufacturing
Journal Articles

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

Samuel I-En Lin, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 54–59.
https://doi.org/10.1115/1.1414135
Published Online: July 7, 2000
View Article titled, Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure
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Topics: Diffraction gratings, Fiber Bragg gratings, Fibers, Packaging, Temperature, Wavelength, Optical fiber, Deformation
Journal Articles

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

Mikio Muraoka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
https://doi.org/10.1115/1.1324674
Published Online: June 28, 2000
View Article titled, The Maximum Stress in Optical Glass Fibers Under Two-Point Bending
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Topics: Bending (Stress), Fibers, Optical glass, Stress, Stress-strain relations, Optical fiber
Journal Articles

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial Paper
J. Electron. Packag. December 1999, 121(4): 213–221.
https://doi.org/10.1115/1.2793843
Published Online: December 1, 1999
View Article titled, Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review
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Topics: Mechanical behavior, Modeling, Mathematics, Microelectronic devices, Optical fiber, Photonics
Journal Articles

Fiber Optics Structural Mechanics: Brief Review

Ephraim Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editor’S Note
J. Electron. Packag. September 1998, 120(3): 217–220.
https://doi.org/10.1115/1.2792625
Published Online: September 1, 1998
View Article titled, Fiber Optics Structural Mechanics: Brief Review
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Topics: Optical fiber, Structural analysis
Journal Articles

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 133–137.
https://doi.org/10.1115/1.2792219
Published Online: June 1, 1997
View Article titled, Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers
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Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics
Journal Articles

Displacement-Limited Buckling of an Optical Fiber

W. W. King
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 39–43.
https://doi.org/10.1115/1.2909300
Published Online: March 1, 1993
View Article titled, Displacement-Limited Buckling of an Optical Fiber
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Topics: Buckling, Displacement, Optical fiber, Fibers, Stress, Deflection
Journal Articles

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

M. Muraoka, H. Abe´, N. Aizawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 403–406.
https://doi.org/10.1115/1.2905472
Published Online: December 1, 1992
View Article titled, The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber
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Topics: Fibers, Fracture (Materials), Optical glass, Stress, Boundary element methods, Geometry, Optical fiber