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Journal Articles

Electroplated Connections Between Carbon Fiber and Nickel

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Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011009.
Paper No: EP-16-1045
https://doi.org/10.1115/1.4035703
Published Online: January 27, 2017
View Articletitled, Electroplated Connections Between Carbon Fiber and Nickel
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Topics: Carbon fibers, Nickel, Metals, Carbon, Solders, Batteries, Electroplating
Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

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M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
https://doi.org/10.1115/1.2229223
Published Online: November 29, 2005
View Articletitled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

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Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Articletitled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

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G. B. Dou, Y. C. Chan, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 609–616.
https://doi.org/10.1115/1.1604808
Published Online: December 15, 2003
View Articletitled, Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
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Topics: Particulate matter, Nickel
Journal Articles

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

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Xiaoping Shui, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 236–238.
https://doi.org/10.1115/1.2792242
Published Online: December 1, 1997
View Articletitled, 0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding
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Topics: Composite materials, Electromagnetic interference, Nickel, Silicones, Cables, Electrical resistivity, Gaskets
Journal Articles

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

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Mingguang Zhu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 417–420.
https://doi.org/10.1115/1.2905429
Published Online: December 1, 1991
View Articletitled, Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors
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Topics: Composite materials, Fibers, Nickel, Silicones, Electrical resistivity, Compression, Copper, Electromagnetic interference, Gaskets, Heating
Journal Articles

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

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C. G. Woychik, A. K. Trivedi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 223–233.
https://doi.org/10.1115/1.2904371
Published Online: September 1, 1990
View Articletitled, A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging
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Topics: Nickel, Packaging, Intermetallic compounds, Tin, Gold plating, Alloys, Contamination, Nickel plating, Particulate matter, Pins (Engineering)