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Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

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Ronald J. Warzoha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2021, 143(2): 020301.
Paper No: EP-21-1004
https://doi.org/10.1115/1.4050407
Published Online: March 19, 2021
View Articletitled, Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
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Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

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Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Articletitled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

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C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Articletitled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Open the PDF for Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging in another window
Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

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Kevin M. Klein, Gregory Ostrowicki, Andrew T. Gewirtz, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021014.
https://doi.org/10.1115/1.3103937
Published Online: April 28, 2009
View Articletitled, Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection
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Topics: Cancer, Manufacturing, Microscale devices, Nanoscale phenomena, Proteins, Electron beams, Lithography, Biomaterials
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

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J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Articletitled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Thermal Phenomena in Nanoscale Transistors

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Eric Pop, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
https://doi.org/10.1115/1.2188950
Published Online: December 14, 2006
View Articletitled, Thermal Phenomena in Nanoscale Transistors
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Topics: Phonons, Silicon, Transistors, Heat, Nanoscale phenomena, Electrons, Nanowires
Journal Articles

Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

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Yongho “Sungtaek” Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 109–114.
https://doi.org/10.1115/1.2165215
Published Online: December 5, 2005
View Articletitled, Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications
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Topics: Electrodes, Heat, Junctions, Thermal resistance, Tunnels, Spintronics, Electrons, Heat conduction, Tunnel construction, Phonons