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Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

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Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
https://doi.org/10.1115/1.4065446
Published Online: May 24, 2024
View Articletitled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
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Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

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Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Articletitled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

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Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Articletitled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
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Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

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Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Articletitled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

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Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Articletitled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

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Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Articletitled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

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J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Articletitled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
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Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Thermal Placement Design for MCM Applications

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Yu-Jung Huang, Shen-Li Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
https://doi.org/10.1115/1.483142
Published Online: November 9, 1999
View Articletitled, Thermal Placement Design for MCM Applications
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Topics: Algorithms, Design, Energy dissipation, Finite element analysis, Multi-chip modules, Simulation results, Reliability, Heat, Thermal management, Temperature distribution
Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

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Q. Yao, J. Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 196–201.
https://doi.org/10.1115/1.2792684
Published Online: September 1, 1999
View Articletitled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

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T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Articletitled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
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Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation
Journal Articles

Development of a Two Matrix Model for Thermal Analysis of a Multichip Module

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M. A. Butterbaugh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 288–293.
https://doi.org/10.1115/1.2792251
Published Online: December 1, 1997
View Articletitled, Development of a Two Matrix Model for Thermal Analysis of a Multichip Module
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Topics: Multi-chip modules, Thermal analysis, Temperature, Computer simulation, Design, Thermal resistance
Journal Articles

Micro Heat Exchangers Consisting of Pin Arrays

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Xiaoqing Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 51–57.
https://doi.org/10.1115/1.2792200
Published Online: March 1, 1997
View Articletitled, Micro Heat Exchangers Consisting of Pin Arrays
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Topics: Heat exchangers, Heat, Computer simulation, Coolants, Flow (Dynamics), Geometry, High temperature superconductors, Multi-chip modules, Nitrogen, Semiconductor wafers
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

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D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Articletitled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

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K. X. Hu, C. P. Yeh, X. S. Wu, K. Wyatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 206–213.
https://doi.org/10.1115/1.2792154
Published Online: December 1, 1996
View Articletitled, An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects
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Topics: Delamination, Multi-chip modules, Thin films, Stress, Finite element analysis, Fracture (Materials), Polymers, Relaxation (Physics), Reliability
Journal Articles

Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy

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L. Economikos, D. E. Kotecki, R. Surprenant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 7–10.
https://doi.org/10.1115/1.2792126
Published Online: March 1, 1996
View Articletitled, Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy
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Topics: Dimensions, Lasers, Metallurgy, Vapors, Metals, Microchannels, Chemical vapor deposition, Circuits, Density, Finite element model
Journal Articles

Chip on Board: Technologies for Multichip Modules

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John H. Lau, Editor, Richard J. Prosman, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1995, 117(2): 165.
https://doi.org/10.1115/1.2792085
Published Online: June 1, 1995
View Articletitled, Chip on Board: Technologies for Multichip Modules
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Topics: Multi-chip modules
Journal Articles

On Murphy’s Integrated Circuit Yield Integral

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John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 159–164.
https://doi.org/10.1115/1.2792084
Published Online: June 1, 1995
View Articletitled, On Murphy’s Integrated Circuit Yield Integral
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Topics: Integrated circuits, Multi-chip modules, Density, Semiconductor wafers
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

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J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Articletitled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
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Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

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A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Articletitled, Optimization of Extruded Type External Heat Sink for Multichip Module
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Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling

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C. O. Gersey, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 78–88.
https://doi.org/10.1115/1.2909305
Published Online: March 1, 1993
View Articletitled, Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
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Topics: Boiling, Critical heat flux, Flow (Dynamics), Nucleate boiling, Subcooling, Heat transfer coefficients, Coolants, Forced convection, Multi-chip modules