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Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Article titled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Article titled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
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Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Article titled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Article titled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Article titled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
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Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Thermal Placement Design for MCM Applications

Yu-Jung Huang, Shen-Li Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
https://doi.org/10.1115/1.483142
Published Online: November 9, 1999
View Article titled, Thermal Placement Design for MCM Applications
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Topics: Algorithms, Design, Energy dissipation, Finite element analysis, Multi-chip modules, Simulation results, Reliability, Heat, Thermal management, Temperature distribution
Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 196–201.
https://doi.org/10.1115/1.2792684
Published Online: September 1, 1999
View Article titled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Article titled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
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Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation
Journal Articles

Development of a Two Matrix Model for Thermal Analysis of a Multichip Module

M. A. Butterbaugh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 288–293.
https://doi.org/10.1115/1.2792251
Published Online: December 1, 1997
View Article titled, Development of a Two Matrix Model for Thermal Analysis of a Multichip Module
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Topics: Multi-chip modules, Thermal analysis, Temperature, Computer simulation, Design, Thermal resistance
Journal Articles

Micro Heat Exchangers Consisting of Pin Arrays

Xiaoqing Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 51–57.
https://doi.org/10.1115/1.2792200
Published Online: March 1, 1997
View Article titled, Micro Heat Exchangers Consisting of Pin Arrays
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Topics: Heat exchangers, Heat, Computer simulation, Coolants, Flow (Dynamics), Geometry, High temperature superconductors, Multi-chip modules, Nitrogen, Semiconductor wafers
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

K. X. Hu, C. P. Yeh, X. S. Wu, K. Wyatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 206–213.
https://doi.org/10.1115/1.2792154
Published Online: December 1, 1996
View Article titled, An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects
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Topics: Delamination, Multi-chip modules, Thin films, Stress, Finite element analysis, Fracture (Materials), Polymers, Relaxation (Physics), Reliability
Journal Articles

Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy

L. Economikos, D. E. Kotecki, R. Surprenant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 7–10.
https://doi.org/10.1115/1.2792126
Published Online: March 1, 1996
View Article titled, Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy
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Topics: Dimensions, Lasers, Metallurgy, Vapors, Metals, Microchannels, Chemical vapor deposition, Circuits, Density, Finite element model
Journal Articles

Chip on Board: Technologies for Multichip Modules

John H. Lau, Editor, Richard J. Prosman, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1995, 117(2): 165.
https://doi.org/10.1115/1.2792085
Published Online: June 1, 1995
View Article titled, Chip on Board: Technologies for Multichip Modules
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Topics: Multi-chip modules
Journal Articles

On Murphy’s Integrated Circuit Yield Integral

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 159–164.
https://doi.org/10.1115/1.2792084
Published Online: June 1, 1995
View Article titled, On Murphy’s Integrated Circuit Yield Integral
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Topics: Integrated circuits, Multi-chip modules, Density, Semiconductor wafers
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
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Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Article titled, Optimization of Extruded Type External Heat Sink for Multichip Module
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Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling

C. O. Gersey, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 78–88.
https://doi.org/10.1115/1.2909305
Published Online: March 1, 1993
View Article titled, Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
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Topics: Boiling, Critical heat flux, Flow (Dynamics), Nucleate boiling, Subcooling, Heat transfer coefficients, Coolants, Forced convection, Multi-chip modules
Journal Articles

Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules

Christopher O. Gersey, Thomas C. Willingham, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 280–289.
https://doi.org/10.1115/1.2905452
Published Online: September 1, 1992
View Article titled, Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules
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Topics: Cooling, Design, Forced convection, Multi-chip modules, Critical heat flux, Heart failure, Flow (Dynamics), Subcooling, Boiling, Coolants