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Multi-chip modules
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Journal Articles
Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
Published Online: May 24, 2024
Journal Articles
Flexible Profile Compact Thermal Models for Practical Geometries
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
Published Online: April 16, 2007
Journal Articles
Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
Published Online: January 25, 2007
Journal Articles
Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
Published Online: January 24, 2005
Journal Articles
On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
Available to PurchaseWen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
Published Online: October 6, 2004
Journal Articles
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
Published Online: July 26, 2002
Journal Articles
Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
Available to PurchaseJ. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
Published Online: September 1, 2000
Journal Articles
Thermal Placement Design for MCM Applications
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
Published Online: November 9, 1999
Journal Articles
Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 196–201.
Published Online: September 1, 1999
Journal Articles
The Effects of Material Properties on Heat Dissipation in High Power Electronics
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
Published Online: September 1, 1998
Journal Articles
Development of a Two Matrix Model for Thermal Analysis of a Multichip Module
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 288–293.
Published Online: December 1, 1997
Journal Articles
Micro Heat Exchangers Consisting of Pin Arrays
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 51–57.
Published Online: March 1, 1997
Journal Articles
Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
Published Online: March 1, 1997
Journal Articles
An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 206–213.
Published Online: December 1, 1996
Journal Articles
Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 7–10.
Published Online: March 1, 1996
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1995, 117(2): 165.
Published Online: June 1, 1995
Topics:
Multi-chip modules
Journal Articles
On Murphy’s Integrated Circuit Yield Integral
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 159–164.
Published Online: June 1, 1995
Journal Articles
Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
Published Online: June 1, 1994
Journal Articles
Optimization of Extruded Type External Heat Sink for Multichip Module
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
Published Online: December 1, 1993
Journal Articles
Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 78–88.
Published Online: March 1, 1993
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