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Journal Articles

Microbead Encapsulation for Protection of Electronic Components

Available to Purchase
Jeffrey R Hill, Alex Chen, Natasha Wilson, Cayden Boll, MeiLi O’Bannon, Dallan Trentman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021007.
Paper No: EP-24-1085
https://doi.org/10.1115/1.4067650
Published Online: February 4, 2025
View Articletitled, Microbead Encapsulation for Protection of Electronic Components
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Topics: Compacting, Electronic components, Epoxy resins, Printed circuit boards, Shock (Mechanics), Surface roughness, Testing, Modeling, Failure, Stress
Journal Articles

Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)

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R. Khalid, M. McMullen, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021005.
Paper No: EP-24-1060
https://doi.org/10.1115/1.4067377
Published Online: December 31, 2024
View Articletitled, Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
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Topics: Condensation, Condensers (steam plant), Flow (Dynamics), Fluids, Friction, Heat exchangers, Pressure, Refrigerants, Temperature, Heat transfer
Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

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Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Articletitled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

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Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Articletitled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
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Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

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Yue Huang, Shang-Shu Li, Yan-Pei Gao, Hai-Bin Zhu, Gao-Yin He, Xiao-Hui Xie, Chun Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031004.
Paper No: EP-23-1045
https://doi.org/10.1115/1.4064703
Published Online: February 28, 2024
View Articletitled, Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
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Topics: Compression, Deformation, Finite element analysis, Flip-chip, Materials properties, Modeling, Bonding, Manufacturing
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

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Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Articletitled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

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Meng-Kai Shih, Guan-Sian Lin, Jonny Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
https://doi.org/10.1115/1.4064355
Published Online: January 12, 2024
View Articletitled, Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
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Topics: Delamination, Diffusion (Physics), Fracture (Materials), Manufacturing, Stress, Temperature, Design, Adhesion, Thermal stresses, Modeling
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

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Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Articletitled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
Open the PDF for Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits in another window
Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application

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Utsav Gupta, Andras Vass-Varnai, Voon Hon Wong, Ayman Fayed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041106.
Paper No: EP-23-1031
https://doi.org/10.1115/1.4063883
Published Online: November 1, 2023
View Articletitled, Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application
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Topics: Design, Electric vehicles, Silicon carbide, Simulation, Modeling, Temperature
Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Free
Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Articletitled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

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Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Articletitled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Special Section on InterPACK2021

Free
Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Free
Okafor Ekene Gabriel, David Ryan Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
https://doi.org/10.1115/1.4055774
Published Online: October 22, 2022
View Articletitled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

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Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Articletitled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

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Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
https://doi.org/10.1115/1.4054698
Published Online: July 13, 2022
View Articletitled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
Open the PDF for Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs in another window
Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions
Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Free
Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
https://doi.org/10.1115/1.4053890
Published Online: March 8, 2022
View Articletitled, Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling
Journal Articles

Special Issue on InterPACK2020

Free
Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Articletitled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Free
Geoffrey A. Garcia, Kody Wakumoto, Joseph J. Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041004.
Paper No: EP-21-1018
https://doi.org/10.1115/1.4052325
Published Online: November 22, 2021
View Articletitled, Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
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Topics: Cantilevers, Design, Deflection, Microfabrication, Metamaterials, Modeling, Finite element analysis, Stress
Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Available to Purchase
Filippo Cataldo, Yuri Carmelo Crea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041110.
Paper No: EP-21-1094
https://doi.org/10.1115/1.4052670
Published Online: November 5, 2021
View Articletitled, Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling
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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling