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Journal Articles

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031008.
https://doi.org/10.1115/1.4006863
Published Online: July 19, 2012
View Article titled, Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
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Topics: Cycles, Eigenvalues, Electronics, Failure, Model development, Reliability, Solders, Temperature, Thermal expansion, Thermomechanics
Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 186–191.
https://doi.org/10.1115/1.1568126
Published Online: June 10, 2003
View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
Open the PDF for Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces in another window
Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics
Journal Articles

J-Lead Solder Joint Thermal Fatigue Life Model

T. E. Wong, L. A. Kachatorian, H. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 186–190.
https://doi.org/10.1115/1.2792682
Published Online: September 1, 1999
View Article titled, J-Lead Solder Joint Thermal Fatigue Life Model
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Topics: Fatigue life, Solder joints, Cycles, Finite element analysis, NASA, Damage, Failure, Fracture (Materials), Probability, Computers
Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 178–184.
https://doi.org/10.1115/1.2792089
Published Online: September 1, 1995
View Article titled, A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
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Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding