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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi

J. Electron. Packag. March 2019, 141(1): 011002.

Paper No: EP-18-1029

DOI: https://doi.org/10.1115/1.4041666

Published Online: February 25, 2019

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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles

Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi

J. Electron. Packag. September 2015, 137(3): 031002.

Paper No: EP-13-1037

DOI: https://doi.org/10.1115/1.4029835

Published Online: September 1, 2015

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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution

Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu

J. Electron. Packag. March 2012, 134(1): 014501.

DOI: https://doi.org/10.1115/1.4005908

Published Online: March 19, 2012

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Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection

Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry

J. Electron. Packag. December 2008, 130(4): 040201.

DOI: https://doi.org/10.1115/1.3039759

Published Online: November 17, 2008

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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells

Journal Articles

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac

J. Electron. Packag. December 2008, 130(4): 041103.

DOI: https://doi.org/10.1115/1.2993148

Published Online: November 13, 2008

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Topics: Compressors, Condensers (steam plant), Cooling, Design, Microchannels, Refrigerants, Refrigeration, Vapors, Compression, Microelectronic devices

Journal Articles

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran

J. Electron. Packag. June 2007, 129(2): 120–128.

DOI: https://doi.org/10.1115/1.2721082

Published Online: October 4, 2006

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Topics: Alloys, Nanoindentation, Plasticity, Solders, Strain gradient, Microelectronic devices

Journal Articles

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Rodrigo Escobar, Brian Smith, Cristina Amon

J. Electron. Packag. June 2006, 128(2): 115–124.

DOI: https://doi.org/10.1115/1.2188951

Published Online: January 19, 2006

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Topics: Phonons, Silicon, Temperature, Thermal conductivity, Thin films, Lattice Boltzmann methods, Mean free path, Microelectronic devices, Electrical conductivity

Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans

J. Electron. Packag. September 2005, 127(3): 255–261.

DOI: https://doi.org/10.1115/1.1939007

Published Online: June 24, 2004

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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress

Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor

J. Electron. Packag. December 2003, 125(4): 465.

DOI: https://doi.org/10.1115/1.1634590

Published Online: December 15, 2003

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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging

Journal Articles

In Honor of Dr. M. M. Yovanovich

J. Electron. Packag. June 2003, 125(2): 165–168.

DOI: https://doi.org/10.1115/1.1568123

Published Online: June 10, 2003

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Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling

Journal Articles

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

E. Suhir, Fellow ASME,

J. Electron. Packag. June 2003, 125(2): 261–267.

DOI: https://doi.org/10.1115/1.1569510

Published Online: June 10, 2003

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Topics: Modeling, Stress, Thermal stresses, Finite element analysis, Photonics, Thermal expansion, Design, Microelectronic devices, Optical fiber, Manufacturing

Journal Articles

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair

J. Electron. Packag. December 2002, 124(4): 317.

DOI: https://doi.org/10.1115/1.1497626

Published Online: December 12, 2002

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Topics: Adhesion, Adhesives, Fracture mechanics, Integrated circuit packaging, Packaging, Polymers, Reliability, Stress, Thermal management, Workshops (Work spaces)

Journal Articles

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

E. Suhir

J. Electron. Packag. September 2002, 124(3): 281–291.

DOI: https://doi.org/10.1115/1.1486470

Published Online: July 26, 2002

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Topics: Failure, Failure mechanisms, Lasers, Life testing, Probability, Reliability, Stress, Temperature, Design, Microelectronic devices

Journal Articles

New Section in the Journal: Reliability of Microelectronics, Photonics and MEMS Materials and Packages

E. Suhir,, Editor

J. Electron. Packag. December 2000, 122(4): 356.

DOI: https://doi.org/10.1115/1.1289629

Published Online: December 1, 2000

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Topics: Microelectromechanical systems, Microelectronic devices, Photonics, Reliability

Journal Articles

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han, Mem. ASME

J. Electron. Packag. September 2000, 122(3): 227–232.

DOI: https://doi.org/10.1115/1.1286315

Published Online: December 20, 1999

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Topics: Interferometry, Surface roughness, Warping, Microelectronic devices

Journal Articles

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

E. Suhir

J. Electron. Packag. December 1999, 121(4): 213–221.

DOI: https://doi.org/10.1115/1.2793843

Published Online: December 1, 1999

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Topics: Mechanical behavior, Modeling, Mathematics, Microelectronic devices, Optical fiber, Photonics

Journal Articles

The Future of Microelectronics and Photonics and the Role of Mechanics and Materials

E. Suhir

J. Electron. Packag. March 1998, 120(1): 1–11.

DOI: https://doi.org/10.1115/1.2792280

Published Online: March 1, 1998

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Topics: Microelectronic devices, Photonics

Journal Articles

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta

J. Electron. Packag. March 1998, 120(1): 35–40.

DOI: https://doi.org/10.1115/1.2792283

Published Online: March 1, 1998

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Topics: Design, Semiconductor wafers, Wire, Cutting, Algorithms, Feedback, Finishes, Finite element methods, Fracture (Materials), Fracture (Process)

Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen

J. Electron. Packag. December 1997, 119(4): 281–287.

DOI: https://doi.org/10.1115/1.2792250

Published Online: December 1, 1997

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Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips

Journal citation

NARROW

Special Section on InterPACK2021

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Multiscale Transient Thermal Analysis of Microelectronics

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Editorial

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

In Honor of Dr. M. M. Yovanovich

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

Special Issue on Poly’2000, London

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

New Section in the Journal: Reliability of Microelectronics, Photonics and MEMS Materials and Packages

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

The Future of Microelectronics and Photonics and the Role of Mechanics and Materials

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

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