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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
https://doi.org/10.1115/1.4041666
Published Online: February 25, 2019
View Articletitled, Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles
Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031002.
Paper No: EP-13-1037
https://doi.org/10.1115/1.4029835
Published Online: September 1, 2015
View Articletitled, Multiscale Transient Thermal Analysis of Microelectronics
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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution
Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2012, 134(1): 014501.
https://doi.org/10.1115/1.4005908
Published Online: March 19, 2012
View Articletitled, Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices
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Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Articletitled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
https://doi.org/10.1115/1.2993148
Published Online: November 13, 2008
View Articletitled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
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Topics: Compressors, Condensers (steam plant), Cooling, Design, Microchannels, Refrigerants, Refrigeration, Vapors, Compression, Microelectronic devices
Journal Articles

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
https://doi.org/10.1115/1.2721082
Published Online: October 4, 2006
View Articletitled, Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
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Topics: Alloys, Nanoindentation, Plasticity, Solders, Strain gradient, Microelectronic devices
Journal Articles

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Rodrigo Escobar, Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
https://doi.org/10.1115/1.2188951
Published Online: January 19, 2006
View Articletitled, Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
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Topics: Phonons, Silicon, Temperature, Thermal conductivity, Thin films, Lattice Boltzmann methods, Mean free path, Microelectronic devices, Electrical conductivity
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Articletitled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
https://doi.org/10.1115/1.1634590
Published Online: December 15, 2003
View Articletitled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging
Journal Articles

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

E. Suhir, Fellow ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
https://doi.org/10.1115/1.1569510
Published Online: June 10, 2003
View Articletitled, Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review
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Topics: Modeling, Stress, Thermal stresses, Finite element analysis, Photonics, Thermal expansion, Design, Microelectronic devices, Optical fiber, Manufacturing
Journal Articles

In Honor of Dr. M. M. Yovanovich

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
https://doi.org/10.1115/1.1568123
Published Online: June 10, 2003
View Articletitled, In Honor of Dr. M. M. Yovanovich
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Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling
Journal Articles

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
https://doi.org/10.1115/1.1497626
Published Online: December 12, 2002
View Articletitled, Special Issue on Poly’2000, London
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Topics: Adhesion, Adhesives, Fracture mechanics, Integrated circuit packaging, Packaging, Polymers, Reliability, Stress, Thermal management, Workshops (Work spaces)
Journal Articles

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 281–291.
https://doi.org/10.1115/1.1486470
Published Online: July 26, 2002
View Articletitled, Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests
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Topics: Failure, Failure mechanisms, Lasers, Life testing, Probability, Reliability, Stress, Temperature, Design, Microelectronic devices
Journal Articles

New Section in the Journal: Reliability of Microelectronics, Photonics and MEMS Materials and Packages

E. Suhir,, Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 356.
https://doi.org/10.1115/1.1289629
Published Online: December 1, 2000
View Articletitled, New Section in the Journal: Reliability of Microelectronics, Photonics and MEMS Materials and Packages
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Topics: Microelectromechanical systems, Microelectronic devices, Photonics, Reliability
Journal Articles

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 227–232.
https://doi.org/10.1115/1.1286315
Published Online: December 20, 1999
View Articletitled, Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry
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Topics: Interferometry, Surface roughness, Warping, Microelectronic devices
Journal Articles

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial Paper
J. Electron. Packag. December 1999, 121(4): 213–221.
https://doi.org/10.1115/1.2793843
Published Online: December 1, 1999
View Articletitled, Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review
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Topics: Mechanical behavior, Modeling, Mathematics, Microelectronic devices, Optical fiber, Photonics
Journal Articles

The Future of Microelectronics and Photonics and the Role of Mechanics and Materials

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 1998, 120(1): 1–11.
https://doi.org/10.1115/1.2792280
Published Online: March 1, 1998
View Articletitled, The Future of Microelectronics and Photonics and the Role of Mechanics and Materials
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Topics: Microelectronic devices, Photonics
Journal Articles

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 35–40.
https://doi.org/10.1115/1.2792283
Published Online: March 1, 1998
View Articletitled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
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Topics: Design, Semiconductor wafers, Wire, Cutting, Algorithms, Feedback, Finishes, Finite element methods, Fracture (Materials), Fracture (Process)
Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 281–287.
https://doi.org/10.1115/1.2792250
Published Online: December 1, 1997
View Articletitled, Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
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Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips