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Journal Articles

Special Issue on InterPACK2023

Free
Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2024, 146(4): 040301.
Paper No: EP-24-1089
https://doi.org/10.1115/1.4066727
Published Online: October 22, 2024
View Articletitled, Special Issue on InterPACK2023
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Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Special Section on InterPACK2021

Free
Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

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Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Articletitled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Free
Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Articletitled, Special Issue on InterPACK 2019 – Part 1
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Available to Purchase
Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Articletitled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

Special Issue on InterPACK 2018

Free
Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Articletitled, Special Issue on InterPACK 2018
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

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Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Articletitled, Reactive Joining of Thermally and Mechanically Sensitive Materials
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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Special Section on InterPACK 2017—Part 2

Free
Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
https://doi.org/10.1115/1.4039963
Published Online: May 9, 2018
View Articletitled, Special Section on InterPACK 2017—Part 2
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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Available to Purchase
Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
View Articletitled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Available to Purchase
Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Articletitled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Open the PDF for Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications in another window
Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

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Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Articletitled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Special Section on InterPACK 2013

Free
Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Articletitled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS

Free
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2014, 136(2): 020301.
Paper No: EP-14-1048
https://doi.org/10.1115/1.4027498
Published Online: April 30, 2014
View Articletitled, Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS
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Topics: Flow (Dynamics), Heat transfer, Microelectromechanical systems, Thermodynamics
Journal Articles

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

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Peisheng Liu, Jinlan Wang, Liangyu Tong, Yujuan Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
https://doi.org/10.1115/1.4027397
Published Online: April 29, 2014
View Articletitled, Advances in the Fabrication Processes and Applications of Wafer Level Packaging
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Topics: Manufacturing, Packaging, Reliability, Semiconductor wafers, Microelectromechanical systems, Solders, Solder joints, Copper, Polymers
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Available to Purchase
Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Articletitled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

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N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, Jyeching Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041003.
https://doi.org/10.1115/1.4005375
Published Online: December 8, 2011
View Articletitled, The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions
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Topics: Munitions, Simulation, Temperature, Thermal stresses, Transients (Dynamics), Electronic packaging, Microelectromechanical systems
Journal Articles

Editorial

Free
Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Articletitled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

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Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Articletitled, Design for Reliability Applied to Packaging of a MOEMS Switch
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Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Journal Articles

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

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Fadi Alsaleem, Mohammad I. Younis, Ronald Miles
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
https://doi.org/10.1115/1.2957319
Published Online: July 29, 2008
View Articletitled, An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
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Topics: Microelectromechanical systems, Shock (Mechanics), Stress, Manufacturing, Diaphragms (Mechanical devices), Diaphragms (Structural)