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Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

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Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Articletitled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Open the PDF for Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film in another window
Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Journal Articles

Adhesive Joining Process and Joint Property With Low Melting Point Filler

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Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
https://doi.org/10.1115/1.1846060
Published Online: March 21, 2005
View Articletitled, Adhesive Joining Process and Joint Property With Low Melting Point Filler
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Topics: Adhesives, Alloys, Fillers (Materials), Heat conduction, Melting point, Resins, Joining, Copper, Epoxy resins, Self-organization
Journal Articles

Advances in Bonding Technology for Electronic Packaging

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Chin C. Lee, Chen Y. Wang, Goran Matijasevic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 201–207.
https://doi.org/10.1115/1.2909318
Published Online: June 1, 1993
View Articletitled, Advances in Bonding Technology for Electronic Packaging
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Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering
Journal Articles

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

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V. Sarihan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 16–21.
https://doi.org/10.1115/1.2909295
Published Online: March 1, 1993
View Articletitled, Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling
Open the PDF for Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling in another window
Topics: Collapse, Simulation, Solder joints, Temperature, Solders, Alloys, Creep, Design, Electronic packages, Flip-chip
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

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Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Articletitled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
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Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys
Journal Articles

Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

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H. D. Solomon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 102–108.
https://doi.org/10.1115/1.2905374
Published Online: June 1, 1991
View Articletitled, Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder
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Topics: Low cycle fatigue, Solders, Tin, Melting point, Silver, Temperature, Ductility, Fatigue, Fatigue life, Soldering