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Journal Articles
Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031001.
Paper No: EP-24-1090
Published Online: March 14, 2025
Journal Articles
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
Published Online: February 20, 2025
Journal Articles
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
Published Online: August 9, 2024
Journal Articles
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
Available to PurchaseJacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041113.
Paper No: EP-24-1048
Published Online: August 9, 2024
Journal Articles
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031004.
Paper No: EP-23-1045
Published Online: February 28, 2024
Journal Articles
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
Published Online: January 12, 2024
Journal Articles
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
Published Online: December 11, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
Published Online: November 1, 2023
Journal Articles
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
Available to PurchaseBeihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
Published Online: November 1, 2023
Journal Articles
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
Published Online: August 17, 2023
Journal Articles
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
Published Online: March 20, 2023
Journal Articles
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
Published Online: December 23, 2022
Journal Articles
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Free
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
Published Online: December 9, 2022
Journal Articles
Design and Fabrication of Leadless Package Structure for Pressure Sensors
Available to PurchaseJunwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
Published Online: November 22, 2021
Journal Articles
Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
Published Online: November 9, 2021
Topics:
Boiling,
Bubbles,
Critical heat flux,
Electrodeposition,
Heat transfer,
Copper,
Dynamics (Mechanics),
Microscale devices,
Fins,
Flow (Dynamics)
Includes: Supplementary data
Journal Articles
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
Published Online: November 2, 2021
Journal Articles
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
Available to PurchaseManu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031001.
Paper No: EP-20-1111
Published Online: September 15, 2021
Journal Articles
A Hybrid Antenna in Package Solution Using FOWLP Technology
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
Published Online: September 15, 2021
Journal Articles
Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
Published Online: September 13, 2021
Journal Articles
Modular Heat Sinks for Enhanced Thermal Management of Electronics
Available to PurchaseMuhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
Published Online: February 22, 2021
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