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Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Accepted Manuscript
Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael Azarian, Daniel Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: September 29, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Circuits, Modeling, Temperature, Testing, Electronics, Electric fields, Manufacturing, Reliability, Breakdown (Electricity)
Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Article titled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
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Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Article titled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article titled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
View Article titled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Open the PDF for Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies in another window
Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
https://doi.org/10.1115/1.4051379
Published Online: September 15, 2021
View Article titled, A Hybrid Antenna in Package Solution Using FOWLP Technology
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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding
Journal Articles

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031001.
Paper No: EP-20-1111
https://doi.org/10.1115/1.4051620
Published Online: September 15, 2021
View Article titled, Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
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Topics: Fatigue, Solder joints, Stiffness, Stress, Temperature, Failure, Deformation, Manufacturing, Shear (Mechanics)
Journal Articles

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
https://doi.org/10.1115/1.4052072
Published Online: September 13, 2021
View Article titled, Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
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Topics: Manufacturing, Metals, Molding materials, Reliability, Silicones, Solders, Epoxy resins, Finite element analysis, Mechanical behavior
Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
https://doi.org/10.1115/1.4049294
Published Online: February 22, 2021
View Article titled, Modular Heat Sinks for Enhanced Thermal Management of Electronics
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Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing
Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031008.
Paper No: EP-20-1100
https://doi.org/10.1115/1.4049577
Published Online: February 19, 2021
View Article titled, Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
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Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes
Journal Articles

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Xing Qiu, Jeffery C. C. Lo, Yuanjie Cheng, S. W. Ricky Lee, Yong Jhe Tseng, Peter Chiu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
https://doi.org/10.1115/1.4049129
Published Online: January 19, 2021
View Article titled, Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
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Topics: Columns (Structural), Manufacturing, Polymers, Reliability, Temperature, Silicon chips, Bonding
Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041004.
Paper No: EP-20-1034
https://doi.org/10.1115/1.4048493
Published Online: October 12, 2020
View Article titled, Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Article titled, Special Issue on InterPACK 2019 – Part 1
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2020, 142(4): 040801.
Paper No: EP-19-1126
https://doi.org/10.1115/1.4047472
Published Online: June 29, 2020
View Article titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals
Journal Articles

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011005.
Paper No: EP-19-1099
https://doi.org/10.1115/1.4046847
Published Online: June 4, 2020
View Article titled, An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer
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Topics: Design, Graphics processing units, Manufacturing, Water, Flow (Dynamics), Testing, Cooling
Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
https://doi.org/10.1115/1.4046933
Published Online: May 4, 2020
View Article titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics