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Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Open Access
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
View Articletitled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling
Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Available to Purchase
Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Articletitled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
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Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Available to Purchase
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Articletitled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
Open the PDF for Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform in another window
Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Available to Purchase
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Articletitled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
Open the PDF for Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module in another window
Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Free
Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Articletitled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Open the PDF for Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers in another window
Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Free
Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Articletitled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Open the PDF for Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink in another window
Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Available to Purchase
Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Articletitled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
Open the PDF for Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes in another window
Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Available to Purchase
Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041002.
Paper No: EP-19-1138
https://doi.org/10.1115/1.4048180
Published Online: September 4, 2020
View Articletitled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
Open the PDF for An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads in another window
Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Available to Purchase
Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Available to Purchase
Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031118.
Paper No: EP-20-1032
https://doi.org/10.1115/1.4047883
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling in another window
Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers
Journal Articles

Liquid Cooling of Compute System

Available to Purchase
Jessica Gullbrand, Mark J. Luckeroth, Mark E. Sprenger, Casey Winkel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010802.
Paper No: EP-18-1054
https://doi.org/10.1115/1.4042802
Published Online: March 1, 2019
View Articletitled, Liquid Cooling of Compute System
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Topics: Cooling, Design, Fluids, Plates (structures), Flow (Dynamics), Manifolds, Temperature
Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Open Access
Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
https://doi.org/10.1115/1.4039264
Published Online: May 11, 2018
View Articletitled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels
Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Available to Purchase
Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
https://doi.org/10.1115/1.4032493
Published Online: March 10, 2016
View Articletitled, Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping
Journal Articles

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Available to Purchase
Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
https://doi.org/10.1115/1.2966437
Published Online: August 12, 2008
View Articletitled, A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
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Topics: Convection, Cooling, Lasers, Nozzles, Radiation (Physics), Temperature, Temperature control, Testing, Manifolds, Pressure
Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

Available to Purchase
M. T. North, C. T. Avedisian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 112–117.
https://doi.org/10.1115/1.2909290
Published Online: March 1, 1993
View Articletitled, Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
Open the PDF for Heat Pipes for Cooling High Flux/High Power Semiconductor Chips in another window
Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design
Journal Articles

Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources

Available to Purchase
D. Schafer, F. P. Incropera, S. Ramadhyani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 359–366.
https://doi.org/10.1115/1.2905421
Published Online: December 1, 1991
View Articletitled, Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources
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Topics: Heat, Impingement cooling, Reynolds number, Boundary layers, Heat transfer, Heat transfer coefficients, Heating, Manifolds, Multi-chip modules, Nozzles