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Journal Articles

Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment

C. D. Smoot, A. A. Hathaway, H. B. Ma, M. T. Crawford, B. M. Huhman, Annie Sobel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031008.
Paper No: EP-13-1139
https://doi.org/10.1115/1.4030642
Published Online: September 1, 2015
View Article titled, Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment
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Topics: Copper, Heat, Heat pipes, Heating, Magnetic fields, Rails, Temperature, Transients (Dynamics), Fluids
Journal Articles

Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes

Kambiz Jahani, Maziar Mohammadi, Mohammad Behshad Shafii, Zahra Shiee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
https://doi.org/10.1115/1.4023847
Published Online: March 28, 2013
View Article titled, Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes
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Topics: Computer cooling, Ferrofluids, Fluids, Heat pipes, Heating, Magnetic fields, Nanofluids, Thermal resistance, Water, Heat transfer
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields