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Journal Articles

Environment-Friendly Electronics: Lead-Free Technology

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ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 537–538.
https://doi.org/10.1115/1.2070093
Published Online: December 1, 2005
View Articletitled, Environment-Friendly Electronics: Lead-Free Technology
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Topics: Alloys, Electronics, Lead-free solders, Solders, Electronic packaging, Soldering, Tin, Low cycle fatigue
Journal Articles

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

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Tae-Sang Park, Soon-Bok Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
https://doi.org/10.1115/1.1871192
Published Online: May 26, 2004
View Articletitled, Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
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Topics: Ball-Grid-Array packaging, Displacement, Fatigue life, Fatigue testing, Low cycle fatigue, Solder joints, Solders, Stress, Testing, Tin
Journal Articles

A Thermodynamic Framework for Damage Mechanics of Solder Joints

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C. Basaran, C.-Y. Yan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1998, 120(4): 379–384.
https://doi.org/10.1115/1.2792650
Published Online: December 1, 1998
View Articletitled, A Thermodynamic Framework for Damage Mechanics of Solder Joints
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Topics: Damage mechanics, Solder joints, Damage, Fatigue life, Alloys, Entropy, Low cycle fatigue, Second law of thermodynamics, Solders, Statistical mechanics
Journal Articles

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

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T. Reinikainen, M. Poech, M. Krumm, J. Kivilahti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 106–113.
https://doi.org/10.1115/1.2792277
Published Online: March 1, 1998
View Articletitled, A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
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Topics: Experimental analysis, Finite element analysis, Shear (Mechanics), Solder joints, Stress concentration, Creep, Simulation results, Stress, Alloys, Deformation
Journal Articles

A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

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S. Russell, R. Caroselli, J. Mason, M. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 122–127.
https://doi.org/10.1115/1.2906408
Published Online: June 1, 1992
View Articletitled, A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics
Open the PDF for A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics in another window
Topics: Fatigue, Nonlinear dynamics, Solders, Creep, Bifurcation, Chaos theory, Deformation, Engineering disciplines, Grain boundaries, Grain size
Journal Articles

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

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Z. Guo, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 112–117.
https://doi.org/10.1115/1.2906406
Published Online: June 1, 1992
View Articletitled, Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue
Open the PDF for Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue in another window
Topics: Deformation, Low cycle fatigue, Solder joints, Tin, Stress, Alloys, Dislocations, Shear (Mechanics)
Journal Articles

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

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Yifan Guo, Charles G. Woychik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 88–92.
https://doi.org/10.1115/1.2905446
Published Online: March 1, 1992
View Articletitled, Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
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Topics: Interferometry, Solder joints, Strain measurement, Surface mount components, Reliability, Solders, Thermal expansion, Dimensions, Electronic packages, Failure
Journal Articles

Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

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H. D. Solomon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 102–108.
https://doi.org/10.1115/1.2905374
Published Online: June 1, 1991
View Articletitled, Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder
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Topics: Low cycle fatigue, Solders, Tin, Melting point, Silver, Temperature, Ductility, Fatigue, Fatigue life, Soldering
Journal Articles

Fatigue Properties of Microelectronics Solder Joints

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N. Nir, T. D. Dudderar, C. C. Wong, A. R. Storm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 92–101.
https://doi.org/10.1115/1.2905390
Published Online: June 1, 1991
View Articletitled, Fatigue Properties of Microelectronics Solder Joints
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Topics: Fatigue properties, Microelectronic devices, Solder joints, Shear (Mechanics), Tin, Vehicles, Computers, Design, Engineering prototypes, Failure
Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

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Yoshiki Oshida, P. C. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 58–62.
https://doi.org/10.1115/1.2905367
Published Online: March 1, 1991
View Articletitled, High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
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Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films
Journal Articles

Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach

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D. Barker, J. Vodzak, A. Dasgupta, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 129–134.
https://doi.org/10.1115/1.2904353
Published Online: June 1, 1990
View Articletitled, Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
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Topics: Fatigue, Solder joints, Cycles, Stress, Fatigue life, Reliability, Solders, Approximation, Damage, Failure
Journal Articles

Strain-Life Behavior in 60/40 Solder

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H. D. Solomon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 75–82.
https://doi.org/10.1115/1.3226525
Published Online: June 1, 1989
View Articletitled, Strain-Life Behavior in 60/40 Solder
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Topics: Curve fitting, Failure, Fatigue life, Low cycle fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Tin