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Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

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Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Articletitled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

A Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations

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A. O. Cifuentes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1991, 113(4): 425–427.
https://doi.org/10.1115/1.2905431
Published Online: December 1, 1991
View Articletitled, A Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations
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Topics: Metals, Temperature, Thermal stresses, Linear systems, Stress