1-14 of 14
Laminar flow
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

M. O. Özdemir, H. Yüncü
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004097
Published Online: September 14, 2011
View Article titled, Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards
Open the PDF for Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards in another window
Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Lumber, Optimization, Pressure, Pressure drop, Temperature, Laminar flow
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Article titled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
Open the PDF for Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules in another window
Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Afzal Husain, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
https://doi.org/10.1115/1.3103931
Published Online: April 1, 2009
View Article titled, Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
Open the PDF for Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section in another window
Topics: Design, Heat sinks, Microchannels, Optimization, Thermal resistance, Heat transfer, Response surface methodology, Shapes, Flow (Dynamics), Computer simulation
Journal Articles

Pressure Drop of Impingement Air Cooled Plate Fin Heat Sinks

Zhipeng Duan, Y. S. Muzychka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 190–194.
https://doi.org/10.1115/1.2721094
Published Online: July 6, 2006
View Article titled, Pressure Drop of Impingement Air Cooled Plate Fin Heat Sinks
Open the PDF for Pressure Drop of Impingement Air Cooled Plate Fin Heat Sinks in another window
Topics: Flow (Dynamics), Heat sinks, Pressure drop, Laminar flow
Journal Articles

Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

X. J. Wei, Y. K. Joshi, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
https://doi.org/10.1115/1.2429711
Published Online: March 2, 2006
View Article titled, Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
Open the PDF for Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface in another window
Topics: Flow (Dynamics), Heat transfer, Laminar flow, Microchannels, Microscale devices, Computer simulation
Journal Articles

Laminar Heat Transfer in Constructal Microchannel Networks With Loops

Xiang-Qi Wang, Christopher Yap, Arun S. Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 273–280.
https://doi.org/10.1115/1.2229228
Published Online: September 20, 2005
View Article titled, Laminar Heat Transfer in Constructal Microchannel Networks With Loops
Open the PDF for Laminar Heat Transfer in Constructal Microchannel Networks With Loops in another window
Topics: Damage, Disks, Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Pressure drop, Temperature, Temperature distribution, Fluids
Journal Articles

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

H. Bhowmik, C. P. Tso, K. W. Tou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 215–222.
https://doi.org/10.1115/1.1938207
Published Online: August 9, 2004
View Article titled, Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel
Open the PDF for Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel in another window
Topics: Computer simulation, Convection, Flow (Dynamics), Forced convection, Heat, Water, Heat flux, Fluids, Laminar flow, Reynolds number
Journal Articles

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

H. Bhowmik, K. W. Tou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 193–199.
https://doi.org/10.1115/1.1997155
Published Online: July 13, 2004
View Article titled, An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel
Open the PDF for An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel in another window
Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Laminar flow, Pumps, Temperature, Transient heat transfer, Transients (Dynamics), Water
Journal Articles

Transient Response of Microchannel Heat Sinks in a Silicon Wafer

J. R. Rujano, M. M. Rahman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 239–246.
https://doi.org/10.1115/1.2792243
Published Online: December 1, 1997
View Article titled, Transient Response of Microchannel Heat Sinks in a Silicon Wafer
Open the PDF for Transient Response of Microchannel Heat Sinks in a Silicon Wafer in another window
Topics: Heat sinks, Microchannels, Semiconductor wafers, Transients (Dynamics), Fluids, Heat transfer, Reynolds number, Temperature, Forced convection, Heat
Journal Articles

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

Ann M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 310–316.
https://doi.org/10.1115/1.2905703
Published Online: December 1, 1994
View Article titled, Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
Open the PDF for Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient in another window
Topics: Heat transfer, Heat transfer coefficients, Convection, Heat conduction, Temperature, Radiation (Physics), Computation, Computer cooling, Ducts, Errors
Journal Articles

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

C. Y. Choi, S. J. Kim, A. Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 198–205.
https://doi.org/10.1115/1.2905686
Published Online: September 1, 1994
View Article titled, Effects of Substrate Conductivity on Convective Cooling of Electronic Components
Open the PDF for Effects of Substrate Conductivity on Convective Cooling of Electronic Components in another window
Topics: Cooling, Electrical conductivity, Electronic components, Thermal conductivity, Heat conduction, Fluids, Heat, Temperature, Boundary-value problems, Convection
Journal Articles

Optimal Thermal Design of Forced Convection Heat Sinks-Analytical

R. W. Knight, J. S. Goodling, D. J. Hall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 313–321.
https://doi.org/10.1115/1.2905412
Published Online: September 1, 1991
View Article titled, Optimal Thermal Design of Forced Convection Heat Sinks-Analytical
Open the PDF for Optimal Thermal Design of Forced Convection Heat Sinks-Analytical in another window
Topics: Design, Forced convection, Heat, Coolants, Cooling, Dimensions, Optimization, Thermal resistance, Copper, Flow (Dynamics)
Journal Articles

Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure

Z.-G. Du, E. Bilgen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 249–254.
https://doi.org/10.1115/1.2904374
Published Online: September 1, 1990
View Article titled, Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure
Open the PDF for Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure in another window
Topics: Air flow, Boundary-value problems, Flow (Dynamics), Heat, Heat transfer, Laminar flow, Natural convection, Temperature, Temperature distribution
Journal Articles

Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards

C. Rajakumar, D. Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 129–134.
https://doi.org/10.1115/1.3226517
Published Online: June 1, 1989
View Article titled, Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards
Open the PDF for Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards in another window
Topics: Finite element analysis, Heat transfer coefficients, Natural convection, Printed circuit boards, Flow (Dynamics), Computation, Convection, Heating, Strips, Buoyancy