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Journal Articles
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041104.
Paper No: EP-24-1025
Published Online: July 25, 2024
Journal Articles
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
Published Online: May 15, 2023
Journal Articles
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
Published Online: September 28, 2022
Journal Articles
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
Published Online: July 13, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
Published Online: November 5, 2021
Journal Articles
Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
Published Online: November 5, 2021
Topics:
Algorithms,
Artificial neural networks,
Bridges (Structures),
Cooling,
Heat sinks,
Junctions,
Machine learning,
Machinery,
Simulation,
Steady state
Includes: Supplementary data
Journal Articles
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
Published Online: September 24, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
Published Online: June 26, 2020
Journal Articles
An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011007.
Paper No: EP-19-1020
Published Online: June 23, 2020
Journal Articles
Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
Published Online: June 4, 2020
Journal Articles
Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
Published Online: July 30, 2019
Journal Articles
Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
Published Online: June 17, 2019
Journal Articles
Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041009.
Paper No: EP-16-1124
Published Online: October 25, 2017
Journal Articles
Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031009.
Paper No: EP-14-1104
Published Online: September 1, 2015
Journal Articles
On-Chip Power Generation Using Ultrathin Thermoelectric Generators
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011005.
Paper No: EP-14-1012
Published Online: October 6, 2014
Journal Articles
A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014502.
Paper No: EP-13-1133
Published Online: October 6, 2014
Journal Articles
Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
Published Online: September 19, 2014
Journal Articles
Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041008.
Paper No: EP-13-1122
Published Online: September 19, 2014
Journal Articles
Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
Published Online: May 12, 2014
Journal Articles
A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011007.
Paper No: EP-13-1072
Published Online: January 16, 2014
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