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Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

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Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Articletitled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

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Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Articletitled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

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David A. Roberson, Ryan B. Wicker, Eric MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031004.
Paper No: EP-13-1041
https://doi.org/10.1115/1.4030286
Published Online: September 1, 2015
View Articletitled, Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics
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Topics: Electronics, Hardening (Curing), Inks, Temperature, Additive manufacturing, Silver, Manufacturing, Damage
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

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Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Articletitled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Open the PDF for Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications in another window
Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)
Journal Articles

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

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Yasutada Nakagawa, Ryohei Yokoyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011005.
https://doi.org/10.1115/1.4005954
Published Online: March 19, 2012
View Articletitled, Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
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Topics: Hardening (Curing), Heating, Optimization, Temperature, Viscosity, Anisotropy
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

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Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Articletitled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Open the PDF for Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV in another window
Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

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Sangil Lee, M. J. Yim, Daniel Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
https://doi.org/10.1115/1.3153369
Published Online: July 31, 2009
View Articletitled, Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Hardening (Curing), Chemical reactions, Wetting, Temperature, Flip-chip, Manufacturing
Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

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Satoru Katsurayama, Hironori Tohmyoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
https://doi.org/10.1115/1.3144153
Published Online: June 23, 2009
View Articletitled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
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Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices
Journal Articles

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

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K. K. Lee, S. C. Tan, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
https://doi.org/10.1115/1.1846068
Published Online: March 21, 2005
View Articletitled, Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
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Topics: Adhesives, Bonding, Hardening (Curing), Shear (Mechanics), Ultraviolet radiation, Fourier transform infrared spectroscopy
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

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Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Articletitled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

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Andrzej Mościcki, Jan Felba, Tadeusz Sobierajski, Józef Kudzia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 91–95.
https://doi.org/10.1115/1.1899165
Published Online: November 25, 2004
View Articletitled, Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications
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Topics: Adhesives, Hardening (Curing), Fillers (Materials)
Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

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C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
https://doi.org/10.1115/1.1510865
Published Online: December 12, 2002
View Articletitled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
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Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)
Journal Articles

Optical Measurements of Shrinkage in UV-Cured Adhesives

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A. J. Hudson, S. C. Martin, M. Hubert, J. K. Spelt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 352–354.
https://doi.org/10.1115/1.1498264
Published Online: December 12, 2002
View Articletitled, Optical Measurements of Shrinkage in UV-Cured Adhesives
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Topics: Adhesives, Hardening (Curing), Shrinkage (Materials), Ultraviolet radiation, Ultraviolet cured adhesives, Optical measurement
Journal Articles

An Analytical Cure Model for Underfill Epoxies

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R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
https://doi.org/10.1115/1.1510864
Published Online: December 12, 2002
View Articletitled, An Analytical Cure Model for Underfill Epoxies
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Topics: Epoxy adhesives, Epoxy resins, Hardening (Curing), Heating, Heat transfer coefficients, Temperature
Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

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L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 97–105.
https://doi.org/10.1115/1.1459471
Published Online: May 2, 2002
View Articletitled, Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
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Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation
Journal Articles

Alternative Curing Methods for FCOB Underfill

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M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Articletitled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating
Journal Articles

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

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J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
https://doi.org/10.1115/1.2793855
Published Online: December 1, 1999
View Articletitled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
Open the PDF for Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB) in another window
Topics: Copper, Epoxy resins, Lamination, Printed circuit boards, Adhesion, Resins, Plasmas (Ionized gases), Atomic force microscopy, Polymerization, Temperature
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

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Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Articletitled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity
Journal Articles

Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

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S. Yi, K. Y. Sze
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1998, 120(4): 385–390.
https://doi.org/10.1115/1.2792651
Published Online: December 1, 1998
View Articletitled, Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages
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Topics: Cooling, Finite element analysis, Hardening (Curing), Heat conduction, Manufacturing, Materials properties, Molded plastics, Molding, Residual stresses, Stress
Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

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A. S. Voloshin, P.-H. Tsao, R. A. Pearson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
https://doi.org/10.1115/1.2792639
Published Online: September 1, 1998
View Articletitled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)