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Journal Articles

Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits

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John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011004.
Paper No: EP-24-1055
https://doi.org/10.1115/1.4065667
Published Online: June 20, 2024
View Articletitled, Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
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Topics: Bridges (Structures), Glass, Integrated circuits, Optics, Switches
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

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Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Articletitled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

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Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
https://doi.org/10.1115/1.4046933
Published Online: May 4, 2020
View Articletitled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

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M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Articletitled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
Open the PDF for Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses in another window
Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

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Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Articletitled, Reactive Joining of Thermally and Mechanically Sensitive Materials
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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

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Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Articletitled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

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Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
https://doi.org/10.1115/1.4037221
Published Online: July 27, 2017
View Articletitled, Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules
Open the PDF for Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules in another window
Topics: Glass, Manufacturing, Filters
Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

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Yanyi Xiao, Wen Wang, Jianhua Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021006.
Paper No: EP-15-1051
https://doi.org/10.1115/1.4033106
Published Online: April 15, 2016
View Articletitled, Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis
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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)
Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

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Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031015.
Paper No: EP-13-1050
https://doi.org/10.1115/1.4028013
Published Online: July 24, 2014
View Articletitled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature
Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

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Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Articletitled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Open the PDF for Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film in another window
Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

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Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Articletitled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Open the PDF for Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV in another window
Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

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Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
https://doi.org/10.1115/1.4000363
Published Online: November 12, 2009
View Articletitled, Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat
Journal Articles

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

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Jianhua Zhang, Fang Yuan, Jinsong Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041008.
https://doi.org/10.1115/1.4000361
Published Online: October 29, 2009
View Articletitled, Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
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Topics: Bonding, Warping, Glass, Temperature
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

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Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Articletitled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

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Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
https://doi.org/10.1115/1.2753920
Published Online: November 29, 2006
View Articletitled, Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature
Journal Articles

PCR Microchip Array Based on Polymer Bonding Technique

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Xiaomei Yu, Ting Li, Lin Hao, Dacheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 38–42.
https://doi.org/10.1115/1.1849231
Published Online: March 21, 2005
View Articletitled, PCR Microchip Array Based on Polymer Bonding Technique
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Topics: Bonding, DNA, Fluorescence, Integrated circuits, Packaging, Photoresists, Polymers, Epoxy adhesives, Epoxy resins, Silicon
Journal Articles

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

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Hong-Seok Min, Young-Chang Joo, Oh-Sung Song
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
https://doi.org/10.1115/1.1649238
Published Online: April 30, 2004
View Articletitled, Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding
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Topics: Annealing, Bonding, Glass, Semiconductor wafers, Temperature, Surface roughness, Scanning probe microscopy
Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

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John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
https://doi.org/10.1115/1.1604807
Published Online: December 15, 2003
View Articletitled, Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses
Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

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J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
https://doi.org/10.1115/1.1615249
Published Online: December 15, 2003
View Articletitled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors
Open the PDF for Humidity-Induced Voltage Shift on MEMS Pressure Sensors in another window
Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension
Journal Articles

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

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John E. Ritter, G. S. Jacome, J. R. Pelch, T. P. Russell, T. J. Lardner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 328–333.
https://doi.org/10.1115/1.1503064
Published Online: December 12, 2002
View Articletitled, Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces
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Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Glass, Stress corrosion cracking, Water, Fatigue cracks, Durability