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Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar

J. Electron. Packag. June 2017, 139(2): 020912.

Paper No: EP-17-1010

DOI: https://doi.org/10.1115/1.4036661

Published Online: June 12, 2017

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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing

Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah

J. Electron. Packag. December 2010, 132(4): 041012.

DOI: https://doi.org/10.1115/1.4002741

Published Online: December 8, 2010

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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus

Journal Articles

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman

J. Electron. Packag. December 2006, 128(4): 405–411.

DOI: https://doi.org/10.1115/1.2386242

Published Online: October 4, 2006

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Topics: Delamination, Fatigue, Fatigue testing, Fracture (Materials), Stress, Thermomechanics, Temperature, Experimental characterization, Fracture (Process), Fracture toughness

Journal Articles

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

Liqiang Cao, Zonghe Lai, Johan Liu

J. Electron. Packag. March 2005, 127(1): 43–46.

DOI: https://doi.org/10.1115/1.1846066

Published Online: March 21, 2005

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Topics: Adhesion, Adhesives, Anisotropy, Testing, Fracture toughness, Reliability, Pressure

Journal Articles

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

A. Polyakov, M. Bartek, J. N. Burghartz

J. Electron. Packag. March 2005, 127(1): 7–11.

DOI: https://doi.org/10.1115/1.1846059

Published Online: March 21, 2005

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Topics: Adhesives, Bonding, Semiconductor wafers, Fracture toughness, Wedges, Tensile strength

Journal Articles

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Mitul Modi, Suresh K. Sitaraman

J. Electron. Packag. September 2004, 126(3): 301–307.

DOI: https://doi.org/10.1115/1.1772410

Published Online: October 6, 2004

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Topics: Fracture toughness, Stress, Titanium, Silicon, Fracture (Materials), Delamination, Metals, Adhesion, Strips, Adhesives

Journal Articles

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu

J. Electron. Packag. March 2004, 126(1): 110–114.

DOI: https://doi.org/10.1115/1.1647123

Published Online: April 30, 2004

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Topics: Fracture toughness, Grinding, Semiconductor wafers, Surface roughness, Polishing, Plasma etching

Journal Articles

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

Timothy Ferguson, Mem. ASME, Jianmin Qu, Fellow ASME

J. Electron. Packag. March 2003, 125(1): 24–30.

DOI: https://doi.org/10.1115/1.1524132

Published Online: March 14, 2003

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Topics: Absorption, Diffusion (Physics), Fracture (Materials), Fracture (Process), Resins, Fracture toughness

Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya

J. Electron. Packag. December 2002, 124(4): 323–327.

DOI: https://doi.org/10.1115/1.1501304

Published Online: December 12, 2002

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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination

Journal Articles

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

J. Auersperg, E. Kieselstein, A. Schubert, B. Michel

J. Electron. Packag. December 2002, 124(4): 318–322.

DOI: https://doi.org/10.1115/1.1501303

Published Online: December 12, 2002

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Topics: Delamination, Finite element analysis, Fracture (Materials), Fracture mechanics, Stress, Fracture toughness, Reliability, Fracture (Process), Integrated circuits, Risk assessment

Journal Articles

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´

J. Electron. Packag. September 2002, 124(3): 271–276.

DOI: https://doi.org/10.1115/1.1481374

Published Online: July 26, 2002

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Topics: Adhesives, Diamonds, Fracture toughness, Methane, Particulate matter, Silicon, Synthetic diamonds, Fracture (Materials), Graphite

Journal Articles

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy Ferguson, Member ASME, Jianmin Qu, Fellow ASME

J. Electron. Packag. June 2002, 124(2): 106–110.

DOI: https://doi.org/10.1115/1.1414133

Published Online: May 2, 2002

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Topics: Absorption, Adhesion, Fracture (Materials), Fracture toughness, Solder masks, Delamination, Stress, Flow (Dynamics), Fracture (Process)

Journal Articles

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen

J. Electron. Packag. March 2000, 122(1): 67–72.

DOI: https://doi.org/10.1115/1.483137

Published Online: December 9, 1999

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Topics: Design, Electronic packages, Electronic packaging, Fracture (Materials), Fracture (Process), Fracture toughness, Stress, Testing, Geometry, Packaging

Journal Articles

Determination of Fracture Toughness for Metal/Polymer Interfaces

V. Sundararaman, S. K. Sitaraman

J. Electron. Packag. December 1999, 121(4): 275–281.

DOI: https://doi.org/10.1115/1.2793852

Published Online: December 1, 1999

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Topics: Fracture toughness, Metals, Polymers, Finite element analysis, Fracture (Materials), Electronic packaging

Journal Articles

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

Adam Kuhl, Jianmin Qu

J. Electron. Packag. June 2000, 122(2): 147–151.

DOI: https://doi.org/10.1115/1.483147

Published Online: September 15, 1999

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Topics: Adhesives, Fracture (Materials), Fracture mechanics, Fracture toughness, Stress, Finite element analysis, Testing

Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim

J. Electron. Packag. December 1998, 120(4): 354–359.

DOI: https://doi.org/10.1115/1.2792646

Published Online: December 1, 1998

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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes

Journal Articles

Adhesion and Reliability of Polymer/Inorganic Interfaces

S.-Y. Kook, J. M. Snodgrass, A. Kirtikar, R. H. Dauskardt

J. Electron. Packag. December 1998, 120(4): 328–335.

DOI: https://doi.org/10.1115/1.2792642

Published Online: December 1, 1998

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Journal Articles

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

J. Jiao, C. K. Gurumurthy, E. J. Kramer, Y. Sha, C. Y. Hui, P. Borgesen

J. Electron. Packag. December 1998, 120(4): 349–353.

DOI: https://doi.org/10.1115/1.2792645

Published Online: December 1, 1998

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Topics: Cantilever beams, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Thermal stresses

Journal Articles

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

H. Krishnamoorthy, H. V. Tippur

J. Electron. Packag. September 1998, 120(3): 267–274.

DOI: https://doi.org/10.1115/1.2792632

Published Online: September 1, 1998

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Topics: Copper, Fracture (Materials), Fracture (Process), Interferometry, Solders, Deformation, Failure, Fracture toughness, Geometry, Strain gages

Journal Articles

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

X. Yan, R. K. Agarwal

J. Electron. Packag. June 1998, 120(2): 150–155.

DOI: https://doi.org/10.1115/1.2792607

Published Online: June 1, 1998

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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Journal citation

NARROW

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Determination of Fracture Toughness for Metal/Polymer Interfaces

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

Adhesion and Reliability of Polymer/Inorganic Interfaces

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

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