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Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031007.

Paper No: EP-21-1039

DOI: https://doi.org/10.1115/1.4051468

Published Online: September 15, 2021

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density

Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen

J. Electron. Packag. December 2018, 140(4): 044502.

Paper No: EP-18-1015

DOI: https://doi.org/10.1115/1.4040794

Published Online: August 6, 2018

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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices

Journal Articles

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura, Masakatsu Maeda

J. Electron. Packag. December 2017, 139(4): 041010.

Paper No: EP-17-1026

DOI: https://doi.org/10.1115/1.4038143

Published Online: October 25, 2017

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Topics: Bonding, Vibration, Flip-chip, Flip-chip devices

Journal Articles

Recent Advances and New Trends in Flip Chip Technology

John H. Lau

J. Electron. Packag. September 2016, 138(3): 030802.

Paper No: EP-16-1052

DOI: https://doi.org/10.1115/1.4034037

Published Online: July 25, 2016

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Topics: Bonding, Flip-chip, Flip-chip assemblies, Flip-chip devices, Manufacturing, Semiconductor wafers, Solders, Columns (Structural), Silicon, Packaging

Journal Articles

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu

J. Electron. Packag. March 2012, 134(1): 011003.

DOI: https://doi.org/10.1115/1.4005914

Published Online: March 19, 2012

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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Non-Newtonian flow, Plates (structures), Fluids, Simulation, Computational fluid dynamics, Finite volume methods, Pressure drop

Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas

J. Electron. Packag. March 2012, 134(1): 011010.

DOI: https://doi.org/10.1115/1.4005904

Published Online: March 19, 2012

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Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)

Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

J. Electron. Packag. June 2011, 133(2): 021007.

DOI: https://doi.org/10.1115/1.4003992

Published Online: June 23, 2011

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Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging

Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah

J. Electron. Packag. December 2010, 132(4): 041012.

DOI: https://doi.org/10.1115/1.4002741

Published Online: December 8, 2010

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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus

Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin

J. Electron. Packag. December 2010, 132(4): 041013.

DOI: https://doi.org/10.1115/1.4002825

Published Online: December 8, 2010

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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers

Journal Articles

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen

J. Electron. Packag. September 2010, 132(3): 031008.

DOI: https://doi.org/10.1115/1.4002010

Published Online: September 9, 2010

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Topics: Alloys, Flip-chip, Flip-chip devices, Solders, Thermal shock, Thermal expansion, Testing, Adhesion, Reliability, Cycles

Journal Articles

Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package

Hu Guojun, Andrew A. O. Tay, Luan Jing-En, Ma Yiyi

J. Electron. Packag. March 2010, 132(1): 011006.

DOI: https://doi.org/10.1115/1.4001145

Published Online: March 19, 2010

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Topics: Ball-Grid-Array packages, Delamination, Flip-chip, Flip-chip devices, Fracture (Materials), Shrinkage (Materials), Stress, Temperature, Epoxy resins, Molding

Journal Articles

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin

J. Electron. Packag. September 2009, 131(3): 031014.

DOI: https://doi.org/10.1115/1.3153369

Published Online: July 31, 2009

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Topics: Flip-chip devices, Flow (Dynamics), Solders, Hardening (Curing), Chemical reactions, Wetting, Temperature, Flip-chip, Manufacturing

Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh

J. Electron. Packag. September 2009, 131(3): 031005.

DOI: https://doi.org/10.1115/1.3144153

Published Online: June 23, 2009

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Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices

Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume

J. Electron. Packag. March 2009, 131(1): 011013.

DOI: https://doi.org/10.1115/1.3068301

Published Online: February 18, 2009

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Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection

Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung

J. Electron. Packag. December 2008, 130(4): 041004.

DOI: https://doi.org/10.1115/1.2993146

Published Online: November 17, 2008

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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints

Journal Articles

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Jin Yang, I. Charles Ume

J. Electron. Packag. September 2008, 130(3): 031009.

DOI: https://doi.org/10.1115/1.2957328

Published Online: August 1, 2008

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Topics: Flip-chip, Flip-chip devices, Inspection, Lasers, Modal analysis, Solders, Ultrasound, Mode shapes

Journal Articles

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Cheng-fu Chen, Pramod C. Karulkar

J. Electron. Packag. September 2008, 130(3): 031005.

DOI: https://doi.org/10.1115/1.2957324

Published Online: July 30, 2008

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Topics: Fillers (Materials), Stress, Particulate matter, Flip-chip packages, Flip-chip devices

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021009.

DOI: https://doi.org/10.1115/1.2912209

Published Online: May 9, 2008

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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021008.

DOI: https://doi.org/10.1115/1.2912188

Published Online: May 9, 2008

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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion

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Journal citation

NARROW

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Recent Advances and New Trends in Flip Chip Technology

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Interactions Between Flip Chip Underfill and Solder Alloy

Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

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