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Journal Articles

Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN

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Calvin Ling, Aizat Abas, Chew Cheng Kai, Muhammad Taufik Azahari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031001.
Paper No: EP-24-1090
https://doi.org/10.1115/1.4067897
Published Online: March 14, 2025
View Articletitled, Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
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Topics: Convolutional neural networks, Image segmentation, Ball-Grid-Array packaging, Algorithms, Flip-chip devices, Flip-chip, Manufacturing
Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

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Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Articletitled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

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Yue Huang, Shang-Shu Li, Yan-Pei Gao, Hai-Bin Zhu, Gao-Yin He, Xiao-Hui Xie, Chun Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031004.
Paper No: EP-23-1045
https://doi.org/10.1115/1.4064703
Published Online: February 28, 2024
View Articletitled, Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
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Topics: Compression, Deformation, Finite element analysis, Flip-chip, Materials properties, Modeling, Bonding, Manufacturing
Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

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Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
https://doi.org/10.1115/1.4053889
Published Online: March 8, 2022
View Articletitled, Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Articletitled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

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Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Articletitled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

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Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
https://doi.org/10.1115/1.4051468
Published Online: September 15, 2021
View Articletitled, Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
Open the PDF for Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip in another window
Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density
Journal Articles

Underfill Flow in Flip-Chip Encapsulation Process: A Review

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Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
https://doi.org/10.1115/1.4050697
Published Online: August 6, 2021
View Articletitled, Underfill Flow in Flip-Chip Encapsulation Process: A Review
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Topics: Flow (Dynamics), Flip-chip, Fluids, Optimization, Design, Reliability
Journal Articles

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

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Fei Chong Ng, Aizat Abas, M. Z. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041009.
Paper No: EP-19-1066
https://doi.org/10.1115/1.4044817
Published Online: October 18, 2019
View Articletitled, Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation
Open the PDF for Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation in another window
Topics: Flip-chip, Flow (Dynamics), Fluids, Pressure
Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

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Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
https://doi.org/10.1115/1.4040794
Published Online: August 6, 2018
View Articletitled, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices
Journal Articles

A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

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X. J. Yao, J. J. Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
https://doi.org/10.1115/1.4038391
Published Online: March 2, 2018
View Articletitled, A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging
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Topics: Flip-chip, Flow (Dynamics), Permeability, Porous materials, Packaging
Journal Articles

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

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Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura, Masakatsu Maeda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
https://doi.org/10.1115/1.4038143
Published Online: October 25, 2017
View Articletitled, Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
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Topics: Bonding, Vibration, Flip-chip, Flip-chip devices
Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

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Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
https://doi.org/10.1115/1.4036066
Published Online: June 14, 2017
View Articletitled, Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission
Journal Articles

Recent Advances and New Trends in Flip Chip Technology

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John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030802.
Paper No: EP-16-1052
https://doi.org/10.1115/1.4034037
Published Online: July 25, 2016
View Articletitled, Recent Advances and New Trends in Flip Chip Technology
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Topics: Bonding, Flip-chip, Flip-chip assemblies, Flip-chip devices, Manufacturing, Semiconductor wafers, Solders, Columns (Structural), Silicon, Packaging
Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

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Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020907.
https://doi.org/10.1115/1.4006707
Published Online: June 11, 2012
View Articletitled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
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Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy
Journal Articles

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

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Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
https://doi.org/10.1115/1.4006705
Published Online: June 11, 2012
View Articletitled, 40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
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Topics: Bonding, Composite materials, Copper, Flip-chip, Silicon chips, Silver
Journal Articles

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

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Kota Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021006.
https://doi.org/10.1115/1.4006142
Published Online: June 11, 2012
View Articletitled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
Open the PDF for Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps in another window
Topics: Silicon chips, Stress, Mechanical properties, Flip-chip, Deformation, Copper
Journal Articles

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

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C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011003.
https://doi.org/10.1115/1.4005914
Published Online: March 19, 2012
View Articletitled, Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Non-Newtonian flow, Plates (structures), Fluids, Simulation, Computational fluid dynamics, Finite volume methods, Pressure drop
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

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Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Articletitled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

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Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Articletitled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
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Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper