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Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

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Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
https://doi.org/10.1115/1.4065939
Published Online: August 9, 2024
View Articletitled, Electrically Conductive Adhesives in Microelectronics Packaging
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Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

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Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Articletitled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

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Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Articletitled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

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Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Articletitled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties
Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

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Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
View Articletitled, Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
Open the PDF for Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers in another window
Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

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Yowching Liaw, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031007.
Paper No: EP-16-1120
https://doi.org/10.1115/1.4037145
Published Online: July 10, 2017
View Articletitled, The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds
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Topics: Fillers (Materials), Molding, Flow (Dynamics), Thermal conductivity, Water absorption, Bending strength
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

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Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Articletitled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement
Journal Articles

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

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Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
https://doi.org/10.1115/1.4034927
Published Online: October 21, 2016
View Articletitled, Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
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Topics: Fillers (Materials), Particulate matter, Cavities, Nanoparticles
Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

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Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041012.
Paper No: EP-13-1130
https://doi.org/10.1115/1.4028332
Published Online: September 19, 2014
View Articletitled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
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Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature
Journal Articles

HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications

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Dhanesh Thomas, Mailadil T. Sebastian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031002.
Paper No: EP-12-1085
https://doi.org/10.1115/1.4027089
Published Online: May 5, 2014
View Articletitled, HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications
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Topics: Composite materials, Fillers (Materials), Microwaves
Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

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Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
https://doi.org/10.1115/1.4003988
Published Online: June 7, 2011
View Articletitled, Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
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Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity
Journal Articles

Thermal Conductivity of Diamond-Containing Grease

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Hung-En Chou, Shang-Ray Yang, Sea-Fue Wang, James C. Sung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
https://doi.org/10.1115/1.4003002
Published Online: December 9, 2010
View Articletitled, Thermal Conductivity of Diamond-Containing Grease
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Topics: Diamonds, Fillers (Materials), Plasma desorption mass spectrometry, Thermal conductivity, Viscosity
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

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Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Articletitled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

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Jun Zeng, Renli Fu, Simeon Agathopoulos, Shaodong Zhang, Xiufeng Song, Hong He
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041006.
https://doi.org/10.1115/1.4000210
Published Online: October 21, 2009
View Articletitled, Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
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Topics: Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Thermal conductivity, Epoxy adhesives, Finite element analysis
Journal Articles

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

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Guojun Hu, Jing-En Luan, Spencer Chew
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011010.
https://doi.org/10.1115/1.3068321
Published Online: February 13, 2009
View Articletitled, Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis
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Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)
Journal Articles

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

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Cheng-fu Chen, Pramod C. Karulkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031005.
https://doi.org/10.1115/1.2957324
Published Online: July 30, 2008
View Articletitled, Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages
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Topics: Fillers (Materials), Stress, Particulate matter, Flip-chip packages, Flip-chip devices
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

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Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
https://doi.org/10.1115/1.2912209
Published Online: May 9, 2008
View Articletitled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves
Journal Articles

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

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Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
https://doi.org/10.1115/1.2804097
Published Online: April 4, 2007
View Articletitled, High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure
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Topics: Ceramics, Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Polymers, Thermal conductivity, Dielectric losses, Polymer composites
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

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Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Articletitled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

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Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
https://doi.org/10.1115/1.1846067
Published Online: June 3, 2005
View Articletitled, Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials
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Topics: Fillers (Materials), Flip-chip devices, Flow (Dynamics), Reliability, Resins, Semiconductor wafers, Flip-chip, Thermal expansion, Epoxy resins, Solder joints