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Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
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Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Article titled, Design for Reliability Applied to Packaging of a MOEMS Switch
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Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Article titled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
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Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

Z. W. Zhong, S. C. Lim, A. Asundi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
https://doi.org/10.1115/1.1846063
Published Online: March 21, 2005
View Article titled, Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging
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Topics: Epoxy adhesives, Fibers, Finite element analysis, Optical fiber, Shear (Mechanics), Silicon, Temperature, MEMS packaging, Epoxy resins
Journal Articles

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Ben Ting, Vincent P. Manno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 299–305.
https://doi.org/10.1115/1.1938206
Published Online: November 1, 2004
View Article titled, Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing
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Topics: Fibers, Lasers, Simulation, Transients (Dynamics), Temperature, Manufacturing, Thermomechanics, Geometry, Displacement, Materials properties
Journal Articles

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, Fellow ASME, C. L. Jiaa, S. J. Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 379–384.
https://doi.org/10.1115/1.1510862
Published Online: December 12, 2002
View Article titled, Corrosion Analysis of a Fiber-Optic Transceiver Housing
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Topics: Corrosion, Fibers, Weight (Mass)
Journal Articles

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

Samuel I-En Lin, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 54–59.
https://doi.org/10.1115/1.1414135
Published Online: July 7, 2000
View Article titled, Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure
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Topics: Diffraction gratings, Fiber Bragg gratings, Fibers, Packaging, Temperature, Wavelength, Optical fiber, Deformation
Journal Articles

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

Mikio Muraoka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
https://doi.org/10.1115/1.1324674
Published Online: June 28, 2000
View Article titled, The Maximum Stress in Optical Glass Fibers Under Two-Point Bending
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Topics: Bending (Stress), Fibers, Optical glass, Stress, Stress-strain relations, Optical fiber
Journal Articles

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

J. Xie, M. Pecht, A. Dasgupta, J. A. Swift, S. J. Wallace
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 286–290.
https://doi.org/10.1115/1.2793854
Published Online: December 1, 1999
View Article titled, A Statistical Mechanical Model of Electrical Carbon Fiber Contacts
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Topics: Carbon fibers, Contact resistance, Fibers, Geometry
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
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Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 372–378.
https://doi.org/10.1115/1.2792649
Published Online: December 1, 1998
View Article titled, A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces
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Topics: Fatigue testing, Polymers, Thermomechanics, Fracture (Materials), Displacement, Cycles, Fatigue, Cantilever beams, Delamination, Failure
Journal Articles

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 133–137.
https://doi.org/10.1115/1.2792219
Published Online: June 1, 1997
View Article titled, Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers
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Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics
Journal Articles

Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 261–265.
https://doi.org/10.1115/1.2792102
Published Online: December 1, 1995
View Article titled, Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design
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Topics: Design, Fibers, Lasers, Optimization, Stress, Rotation, Buckling, Compressive stress, Deformation, Optical instruments
Journal Articles

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Mary J. Li, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 225–229.
https://doi.org/10.1115/1.2792096
Published Online: September 1, 1995
View Article titled, Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages
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Topics: Electronic packages, Electrons, Failure mechanisms, Bonding, Failure, Fibers, Microcracks, Printed circuit boards, Resins, Scanning electron microscopy
Journal Articles

Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1993, 115(3): 337–339.
https://doi.org/10.1115/1.2909337
Published Online: September 1, 1993
View Article titled, Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads
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Topics: Deflection, Fibers, Optical glass, Stress
Journal Articles

Displacement-Limited Buckling of an Optical Fiber

W. W. King
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 39–43.
https://doi.org/10.1115/1.2909300
Published Online: March 1, 1993
View Article titled, Displacement-Limited Buckling of an Optical Fiber
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Topics: Buckling, Displacement, Optical fiber, Fibers, Stress, Deflection
Journal Articles

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

M. Muraoka, H. Abe´, N. Aizawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 403–406.
https://doi.org/10.1115/1.2905472
Published Online: December 1, 1992
View Article titled, The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber
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Topics: Fibers, Fracture (Materials), Optical glass, Stress, Boundary element methods, Geometry, Optical fiber
Journal Articles

Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 246–250.
https://doi.org/10.1115/1.2906425
Published Online: June 1, 1992
View Article titled, Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers
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Topics: Fibers, Optical glass, Compression, Stress, Stress-strain relations, Tension, Coatings, Deformation
Journal Articles

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Mingguang Zhu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 417–420.
https://doi.org/10.1115/1.2905429
Published Online: December 1, 1991
View Article titled, Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors
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Topics: Composite materials, Fibers, Nickel, Silicones, Electrical resistivity, Compression, Copper, Electromagnetic interference, Gaskets, Heating