1-20 of 23
Fatigue cracks
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
https://doi.org/10.1115/1.4006708
Published Online: July 18, 2012
View Article titled, Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
Open the PDF for Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance in another window
Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
https://doi.org/10.1115/1.2840057
Published Online: April 15, 2008
View Article titled, A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
Open the PDF for A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints in another window
Topics: Fatigue, Fatigue cracks, Fracture (Materials), Fracture mechanics, Modeling, Solder joints, Solders, Tin, Damage, Creep
Journal Articles

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco, Jerome A. Regent, J. Mark Grazier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
https://doi.org/10.1115/1.2837515
Published Online: January 31, 2008
View Article titled, Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
Open the PDF for Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects in another window
Topics: Ball-Grid-Array packaging, Cycles, Fatigue cracks, Fatigue life, Finite element analysis, Fracture (Materials), Manufacturing, Solder joints, Solders, Lead-free solders
Journal Articles

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

T. Zhang, S. Rahman, K. K. Choi, K. Cho, P. Baker, M. Shakil, D. Heitkamp
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
https://doi.org/10.1115/1.2721092
Published Online: July 5, 2006
View Article titled, A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems
Open the PDF for A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems in another window
Topics: Deformation, Durability, Fatigue, Fatigue cracks, Fatigue life, Solder joints, Solders, Cycles, Fracture (Materials), Stress
Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
https://doi.org/10.1115/1.1520430
Published Online: March 14, 2003
View Article titled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
Open the PDF for Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages in another window
Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress
Journal Articles

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Ki-Ju Kang, Seon-Ho Choi, Tae-Sung Bae
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
https://doi.org/10.1115/1.1510863
Published Online: December 12, 2002
View Article titled, Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
Open the PDF for Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints in another window
Topics: Fatigue cracks, Fracture (Materials), Solder joints, Solders, Stress, Fatigue testing, Intermetallic compounds
Journal Articles

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

John E. Ritter, G. S. Jacome, J. R. Pelch, T. P. Russell, T. J. Lardner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 328–333.
https://doi.org/10.1115/1.1503064
Published Online: December 12, 2002
View Article titled, Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces
Open the PDF for Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces in another window
Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Glass, Stress corrosion cracking, Water, Fatigue cracks, Durability
Journal Articles

Adhesion and Reliability of Epoxy/Glass Interfaces

John E. Ritter, Armin Huseinovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. December 2001, 123(4): 401–404.
https://doi.org/10.1115/1.1388560
Published Online: January 3, 2000
View Article titled, Adhesion and Reliability of Epoxy/Glass Interfaces
Open the PDF for Adhesion and Reliability of Epoxy/Glass Interfaces in another window
Topics: Adhesion, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Glass, Reliability, Water, Polymers, Fatigue
Journal Articles

Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder

J. Zhao and, Y. Mutoh, T. Ogawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 311–315.
https://doi.org/10.1115/1.1371780
Published Online: March 17, 1999
View Article titled, Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder
Open the PDF for Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder in another window
Topics: Fatigue cracks, Fracture (Materials), Solders, Stress, Fracture (Process)
Journal Articles

Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints

D. Yao, J. K. Shang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 114–118.
https://doi.org/10.1115/1.2792212
Published Online: June 1, 1997
View Article titled, Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints
Open the PDF for Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Stress, Tin, Shear (Mechanics), Solders
Journal Articles

Life Prediction of Solder Joints by Damage and Fracture Mechanics

S. H. Ju, B. I. Sandor, M. E. Plesha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 193–200.
https://doi.org/10.1115/1.2792152
Published Online: December 1, 1996
View Article titled, Life Prediction of Solder Joints by Damage and Fracture Mechanics
Open the PDF for Life Prediction of Solder Joints by Damage and Fracture Mechanics in another window
Topics: Damage, Fracture mechanics, Solder joints, Fracture (Materials), Damage mechanics, Fatigue life, Computers, Fatigue, Finite element methods, Anisotropy
Journal Articles

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

J. K. Shang, Daping Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 170–173.
https://doi.org/10.1115/1.2792148
Published Online: September 1, 1996
View Article titled, Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints
Open the PDF for Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints in another window
Topics: Fatigue cracks, Interface roughness, Solder joints, Tin, Fracture (Materials), Elasticity, Fracture mechanics, Intermetallic compounds, Shear strength, Solders
Journal Articles

Fatigue Crack Initiation in Solder Joints

Z. Zhang, Daping Yao, J. K. Shang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 41–44.
https://doi.org/10.1115/1.2792129
Published Online: June 1, 1996
View Article titled, Fatigue Crack Initiation in Solder Joints
Open the PDF for Fatigue Crack Initiation in Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Cycles, Fatigue, Finite element methods, Fracture (Materials), Simulation, Solders, Stress
Journal Articles

An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints

Daping Yao, Z. Zhang, J. K. Shang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 45–48.
https://doi.org/10.1115/1.2792130
Published Online: June 1, 1996
View Article titled, An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints
Open the PDF for An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Fracture (Materials), Solders, Failure, Fatigue, Finite element analysis, Sands
Journal Articles

Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints

Zhenfeng Guo, Hans Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 49–54.
https://doi.org/10.1115/1.2792131
Published Online: June 1, 1996
View Article titled, Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints
Open the PDF for Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints in another window
Topics: Deformation, Fatigue, Solder joints, Thermomechanics, Cooling, Creep, Fatigue cracks, Fatigue life, Stress, Temperature
Journal Articles

A New Method to Determine Crack Shape and Size in Solder Joints

T. Reinikainen, F. W. Wulff, W. Kolbe, T. Ahrens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 266–269.
https://doi.org/10.1115/1.2792103
Published Online: December 1, 1995
View Article titled, A New Method to Determine Crack Shape and Size in Solder Joints
Open the PDF for A New Method to Determine Crack Shape and Size in Solder Joints in another window
Topics: Fracture (Materials), Shapes, Solder joints, Solders, Computer-aided design, Fatigue cracks, Capacitors, Ceramics, Copper, Image processing
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Article titled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
Open the PDF for Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints in another window
Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

Z. Guo, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 159–164.
https://doi.org/10.1115/1.2909312
Published Online: June 1, 1993
View Article titled, Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
Open the PDF for Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Shear (Mechanics), Solders, Intermetallic compounds, Metals, Preferences, Temperature
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Article titled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
Open the PDF for Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling in another window
Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys