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Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo

J. Electron. Packag. September 2023, 145(3): 034502.

Paper No: EP-22-1060

DOI: https://doi.org/10.1115/1.4056717

Published Online: February 8, 2023

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Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

DOI: https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh

J. Electron. Packag. December 2019, 141(4): 041007.

Paper No: EP-19-1034

DOI: https://doi.org/10.1115/1.4044961

Published Online: October 18, 2019

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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness

Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle

J. Electron. Packag. September 2019, 141(3): 031012.

Paper No: EP-18-1098

DOI: https://doi.org/10.1115/1.4043646

Published Online: June 17, 2019

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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics

Journal Articles

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Lei Wang, Jun Wang, Fei Xiao

J. Electron. Packag. March 2019, 141(1): 011003.

Paper No: EP-18-1037

DOI: https://doi.org/10.1115/1.4041714

Published Online: February 25, 2019

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Topics: Columns (Structural), Copper, Shear (Mechanics), Stress, Failure, Finite element analysis, Failure mechanisms

Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm

J. Electron. Packag. December 2018, 140(4): 041004.

Paper No: EP-17-1062

DOI: https://doi.org/10.1115/1.4040923

Published Online: August 20, 2018

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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders

Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

J. Electron. Packag. June 2018, 140(2): 020905.

Paper No: EP-17-1083

DOI: https://doi.org/10.1115/1.4039301

Published Online: May 9, 2018

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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue

Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

J. Electron. Packag. March 2018, 140(1): 010903.

Paper No: EP-17-1090

DOI: https://doi.org/10.1115/1.4039333

Published Online: March 2, 2018

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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation

Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta

J. Electron. Packag. September 2017, 139(3): 031001.

Paper No: EP-15-1102

DOI: https://doi.org/10.1115/1.4036187

Published Online: June 14, 2017

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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires

Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin

J. Electron. Packag. March 2016, 138(1): 011002.

Paper No: EP-15-1079

DOI: https://doi.org/10.1115/1.4032349

Published Online: March 10, 2016

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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin

Journal Articles

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang

J. Electron. Packag. September 2015, 137(3): 031007.

Paper No: EP-14-1083

DOI: https://doi.org/10.1115/1.4030392

Published Online: September 1, 2015

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Topics: Cycles, Glass transition, Reliability, Solders, Stress, Temperature, Numerical analysis, Failure, Tin, Failure mechanisms

Journal Articles

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao, Li Zhang, Chi Ming Lai

J. Electron. Packag. September 2015, 137(3): 031016.

Paper No: EP-15-1016

DOI: https://doi.org/10.1115/1.4030974

Published Online: July 21, 2015

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Topics: Ferronickel, Finite element analysis, Reliability, Semiconductor wafers, Solders, Temperature, Fracture (Materials), Failure mechanisms, Alloys, Stress

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim

J. Electron. Packag. June 2013, 135(2): 021010.

Paper No: EP-12-1099

DOI: https://doi.org/10.1115/1.4024013

Published Online: April 12, 2013

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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics

Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park

J. Electron. Packag. December 2012, 134(4): 041008.

DOI: https://doi.org/10.1115/1.4007674

Published Online: November 16, 2012

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Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis

Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht

J. Electron. Packag. June 2012, 134(2): 021009.

DOI: https://doi.org/10.1115/1.4006704

Published Online: June 11, 2012

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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms

Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari

J. Electron. Packag. June 2012, 134(2): 020905.

DOI: https://doi.org/10.1115/1.4005906

Published Online: June 11, 2012

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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)

Journal Articles

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Tong An, Fei Qin

J. Electron. Packag. September 2011, 133(3): 031004.

DOI: https://doi.org/10.1115/1.4004870

Published Online: September 14, 2011

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Topics: Fracture (Materials), Fracture (Process), Solder joints, Solders, Tin, Intermetallic compounds, Failure mechanisms, Damage

Journal Articles

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Jose Omar S. Amistoso, Alberto V. Amorsolo, Jr.

J. Electron. Packag. December 2009, 131(4): 041004.

DOI: https://doi.org/10.1115/1.4000206

Published Online: October 21, 2009

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Topics: Intermetallic compounds, Solders, Temperature, Tin, Semiconductor wafers, Failure mechanisms

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Journal citation

NARROW

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Stress–Strain Behavior of SAC305 at High Strain Rates

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

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