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Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys

Jorge Mireles, Ho-Chan Kim, In Hwan Lee, David Espalin, Francisco Medina, Eric MacDonald, Ryan Wicker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011008.
Paper No: EP-12-1034
https://doi.org/10.1115/1.4007160
Published Online: February 26, 2013
View Article titled, Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys
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Topics: Alloys, Extruding, Melting, Modeling, Solders, Temperature, Tin, Flow (Dynamics)
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding