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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
https://doi.org/10.1115/1.4051752
Published Online: August 9, 2021
View Article titled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption
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Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability
Journal Articles

Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011010.
Paper No: EP-18-1094
https://doi.org/10.1115/1.4045156
Published Online: November 8, 2019
View Article titled, Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
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Topics: Fluids, Pumps, Temperature, Thermocouples, Low temperature, Energy consumption
Journal Articles

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041004.
Paper No: EP-18-1058
https://doi.org/10.1115/1.4044129
Published Online: July 12, 2019
View Article titled, Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
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Topics: Cooling systems, Data centers, Energy consumption, Flow (Dynamics), Reliability, Temperature, Energy efficiency, Simulation, Control equipment
Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
https://doi.org/10.1115/1.4042983
Published Online: April 10, 2019
View Article titled, Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature
Journal Articles

Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions

Richard Eiland, John Edward Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer, Verrendra Mulay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041005.
Paper No: EP-17-1020
https://doi.org/10.1115/1.4037526
Published Online: September 7, 2017
View Article titled, Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions
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Topics: Cooling, Flow (Dynamics), Mineral oil, Temperature, Energy consumption, Data centers, Testing, Fluids
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
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Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Journal Articles

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021007.
https://doi.org/10.1115/1.4005905
Published Online: June 11, 2012
View Article titled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
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Topics: Algorithms, Circuits, Heat, Temperature, Temperature control, Thermal resistance, Thermoelectric cooling, Energy consumption, Photonics, Heat sinks
Journal Articles

Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation

Dustin W. Demetriou, H. Ezzat Khalifa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020904.
https://doi.org/10.1115/1.4005907
Published Online: June 11, 2012
View Article titled, Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation
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Topics: Computational fluid dynamics, Cooling, Data centers, Energy consumption, Flow (Dynamics), Optimization, Temperature, Tiles, Refrigeration, Fans
Journal Articles

Coordinated Optimization of Cooling and IT Power in Data Centers

Emad Samadiani, Hrishikesh Amur, Bhavani Krishnan, Yogendra Joshi, Karsten Schwan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
https://doi.org/10.1115/1.4001858
Published Online: September 9, 2010
View Article titled, Coordinated Optimization of Cooling and IT Power in Data Centers
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Topics: Cooling, Data centers, Design, Optimization, Modeling, Energy consumption
Journal Articles

Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021009.
https://doi.org/10.1115/1.3103952
Published Online: April 2, 2009
View Article titled, Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
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Topics: Cooling, Data centers, Flow (Dynamics), Heat, Temperature, Water, Energy consumption, Heat transfer, Coolants, Cooling towers
Journal Articles

Viability of Dynamic Cooling Control in a Data Center Environment

Timothy D. Boucher, David M. Auslander, Cullen E. Bash, Clifford C. Federspiel, Chandrakant D. Patel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 137–144.
https://doi.org/10.1115/1.2165214
Published Online: November 11, 2005
View Article titled, Viability of Dynamic Cooling Control in a Data Center Environment
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Topics: Cooling, Data centers, Flow (Dynamics), Temperature, Vents, Thermal management, Tiles, Energy consumption, Heat
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

A. J. Scholand, R. E. Fulton, B. Bras
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 31–36.
https://doi.org/10.1115/1.2792658
Published Online: March 1, 1999
View Article titled, An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life
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Topics: Fatigue life, Genetic algorithms, Printed circuit boards, Algorithms, Approximation, Design, Energy consumption, Epoxy adhesives, Epoxy resins, Fatigue
Journal Articles

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 135–140.
https://doi.org/10.1115/1.2792599
Published Online: June 1, 1998
View Article titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool
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Topics: Carbon, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption