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Journal Articles

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

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Whit Vinson, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
https://doi.org/10.1115/1.4066014
Published Online: August 9, 2024
View Articletitled, Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
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Topics: Current density, Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Electrons
Journal Articles

Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag., 145 (2), p. 021005)

Free
Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017002.
Paper No: EP-23-1076
https://doi.org/10.1115/1.4063546
Published Online: October 5, 2023
View Articletitled, Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag., 145 (2), p. 021005)
Open the PDF for Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag., 145 (2), p. 021005) in another window
Topics: Dynamic modeling, Electrons, Power conversion systems, Stress
Journal Articles

Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]

Free
Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017001.
Paper No: EP-23-1056
https://doi.org/10.1115/1.4063174
Published Online: August 25, 2023
View Articletitled, Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]
Open the PDF for Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ] in another window
Topics: Electrons, Current density
Journal Articles

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

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Hongfeng Jia, Huabin Yu, Zhongjie Ren, Chong Xing, Zhongling Liu, Yang Kang, Haiding Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031115.
Paper No: EP-20-1017
https://doi.org/10.1115/1.4047286
Published Online: June 8, 2020
View Articletitled, Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer
Open the PDF for Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer in another window
Topics: Electrons, Light-emitting diodes, Leakage
Journal Articles

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

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Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031108.
Paper No: EP-19-1132
https://doi.org/10.1115/1.4046934
Published Online: May 4, 2020
View Articletitled, Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region
Open the PDF for Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region in another window
Topics: Electric fields, Electrons, Gallium nitride, Indium gallium nitride, Light-emitting diodes, Polarization (Electricity), Polarization (Light), Polarization (Waves), Quantum wells, Leakage
Journal Articles

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Open Access
Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031007.
Paper No: EP-18-1093
https://doi.org/10.1115/1.4043477
Published Online: May 17, 2019
View Articletitled, Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation
Open the PDF for Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation in another window
Topics: Gallium nitride, Heat, Simulation, Temperature, Transistors, Temperature distribution, Temperature measurement, Thermal properties, Gates (Closures), Thermal analysis
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

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Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Articletitled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Journal Articles

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Free
Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2017, 139(1): 017001.
Paper No: EP-16-1133
https://doi.org/10.1115/1.4035707
Published Online: January 19, 2017
View Articletitled, Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
Open the PDF for Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927] in another window
Topics: Electrons, Packaging
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

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Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
View Articletitled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems
Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

Free
K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. September 2016, 138(3): 037001.
Paper No: EP-16-1057
https://doi.org/10.1115/1.4033633
Published Online: May 25, 2016
View Articletitled, Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]
Open the PDF for Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ] in another window
Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders
Journal Articles

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)

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M. Dube, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045502.
https://doi.org/10.1115/1.4000902
Published Online: November 17, 2011
View Articletitled, Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)
Open the PDF for Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156) in another window
Topics: Electrons, Solders, Hardening
Journal Articles

Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)

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Chandra S. Desai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045501.
https://doi.org/10.1115/1.4000901
Published Online: October 25, 2011
View Articletitled, Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)
Open the PDF for Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156) in another window
Topics: Electrons, Modeling, Solders
Journal Articles

Thermal Phenomena in Nanoscale Transistors

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Eric Pop, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
https://doi.org/10.1115/1.2188950
Published Online: December 14, 2006
View Articletitled, Thermal Phenomena in Nanoscale Transistors
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Topics: Phonons, Silicon, Transistors, Heat, Nanoscale phenomena, Electrons, Nanowires
Journal Articles

Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

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Yongho “Sungtaek” Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 109–114.
https://doi.org/10.1115/1.2165215
Published Online: December 5, 2005
View Articletitled, Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications
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Topics: Electrodes, Heat, Junctions, Thermal resistance, Tunnels, Spintronics, Electrons, Heat conduction, Tunnel construction, Phonons
Journal Articles

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

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Zongrong Liu and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. June 2001, 123(2): 159.
https://doi.org/10.1115/1.1371772
Published Online: June 1, 2001
View Articletitled, Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]
Open the PDF for Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69] in another window
Topics: Electrons, Glass, Metals, Thick films, Adhesion, Electrical resistance, Packaging, Titanium alloys
Journal Articles

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

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Yunsheng Xu,, Xiangcheng Luo, and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. June 2001, 123(2): 159.
https://doi.org/10.1115/1.1371771
Published Online: June 1, 2001
View Articletitled, Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]
Open the PDF for Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131] in another window
Topics: Electrons, Interface phenomena, Sodium, Sodium compounds, Thermal conductivity
Journal Articles

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

Free
X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
https://doi.org/10.1115/1.483136
Published Online: March 1, 2000
View Articletitled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]
Open the PDF for Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185] in another window
Topics: Alloys, Electrons, Mechanical properties, Solders, Temperature, Eutectic alloys, Soldering, Stress-strain relations, Thermomechanical treatment
Journal Articles

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

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Mary J. Li, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 225–229.
https://doi.org/10.1115/1.2792096
Published Online: September 1, 1995
View Articletitled, Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages
Open the PDF for Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages in another window
Topics: Electronic packages, Electrons, Failure mechanisms, Bonding, Failure, Fibers, Microcracks, Printed circuit boards, Resins, Scanning electron microscopy
Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

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Wei Qin, Ira M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 212–219.
https://doi.org/10.1115/1.2905688
Published Online: September 1, 1994
View Articletitled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process
Open the PDF for Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process in another window
Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

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Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
View Articletitled, Time-Dependent Ductility of Electro-Deposited Copper
Open the PDF for Time-Dependent Ductility of Electro-Deposited Copper in another window
Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size