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Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson

Publisher: ASME

J. Electron. Packag. June 2025, 147(2): 021009.

Paper No: EP-24-1066

https://doi.org/10.1115/1.4067649

Published Online: February 20, 2025

View Articletitled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling

Journal Articles

Special Issue on InterPACK2023

Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 040301.

Paper No: EP-24-1089

https://doi.org/10.1115/1.4066727

Published Online: October 22, 2024

View Articletitled, Special Issue on InterPACK2023

Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems

Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041111.

Paper No: EP-24-1027

https://doi.org/10.1115/1.4065947

Published Online: August 9, 2024

View Articletitled, Convection Cooling of Power Electronics Operating in Deep-Space

Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling

Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041112.

Paper No: EP-24-1042

https://doi.org/10.1115/1.4066044

Published Online: August 9, 2024

View Articletitled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability

Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041107.

Paper No: EP-24-1022

https://doi.org/10.1115/1.4065943

Published Online: July 26, 2024

View Articletitled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design

Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041104.

Paper No: EP-24-1025

https://doi.org/10.1115/1.4065944

Published Online: July 25, 2024

View Articletitled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators

Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041103.

Paper No: EP-24-1036

https://doi.org/10.1115/1.4065649

Published Online: June 20, 2024

View Articletitled, Acoustic Characterization of Integrated Circuits During Operation

Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems

Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen

Publisher: ASME

J. Electron. Packag. December 2023, 145(4): 040301.

Paper No: EP-23-1077

https://doi.org/10.1115/1.4063893

Published Online: November 1, 2023

View Articletitled, Special Issue on InterPACK2022

Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion

Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta

Publisher: ASME

J. Electron. Packag. December 2023, 145(4): 041105.

Paper No: EP-23-1012

https://doi.org/10.1115/1.4063541

Published Online: November 1, 2023

View Articletitled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing

Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink

Publisher: ASME

J. Electron. Packag. December 2023, 145(4): 041103.

Paper No: EP-23-1032

https://doi.org/10.1115/1.4063484

Published Online: October 9, 2023

View Articletitled, Converging Jet Impingement for Enhanced Liquid Cooling

Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation

Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

Publisher: ASME

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

View Articletitled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

Publisher: ASME

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

View Articletitled, Special Section on InterPACK2021

Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

Publisher: ASME

J. Electron. Packag. March 2023, 145(1): 011109.

Paper No: EP-22-1035

https://doi.org/10.1115/1.4056477

Published Online: January 11, 2023

View Articletitled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver

Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi

Publisher: ASME

J. Electron. Packag. September 2023, 145(3): 034501.

Paper No: EP-22-1053

https://doi.org/10.1115/1.4056306

Published Online: December 9, 2022

View Articletitled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)

Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill

Publisher: ASME

J. Electron. Packag. June 2023, 145(2): 021011.

Paper No: EP-22-1029

https://doi.org/10.1115/1.4055986

Published Online: November 23, 2022

View Articletitled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics

Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao

Publisher: ASME

J. Electron. Packag. March 2023, 145(1): 011106.

Paper No: EP-22-1021

https://doi.org/10.1115/1.4056030

Published Online: November 23, 2022

View Articletitled, Module-Level Thermal Interface Material Degradation in HALT

Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating

Includes: Supplementary data

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

Publisher: ASME

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

View Articletitled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink

Publisher: ASME

J. Electron. Packag. June 2022, 144(2): 024502.

Paper No: EP-21-1049

https://doi.org/10.1115/1.4053642

Published Online: February 16, 2022

View Articletitled, Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron

Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar

Publisher: ASME

J. Electron. Packag. June 2022, 144(2): 020301.

Paper No: EP-21-1158

https://doi.org/10.1115/1.4053122

Published Online: January 4, 2022

View Articletitled, Special Issue on InterPACK2020

Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling

Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

Publisher: ASME

J. Electron. Packag. June 2022, 144(2): 021113.

Paper No: EP-21-1059

https://doi.org/10.1115/1.4052715

Published Online: January 4, 2022

View Articletitled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes

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Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Special Issue on InterPACK2023

Convection Cooling of Power Electronics Operating in Deep-Space

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Acoustic Characterization of Integrated Circuits During Operation

Special Issue on InterPACK2022

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Converging Jet Impingement for Enhanced Liquid Cooling

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Special Section on InterPACK2021

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Module-Level Thermal Interface Material Degradation in HALT

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Special Issue on InterPACK2020

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

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