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Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108.

Paper No: EP-21-1037

DOI: https://doi.org/10.1115/1.4052711

Published Online: November 2, 2021

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Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing

Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet

J. Electron. Packag. March 2022, 144(1): 011008.

Paper No: EP-20-1121

DOI: https://doi.org/10.1115/1.4050200

Published Online: August 6, 2021

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Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction

Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham

J. Electron. Packag. December 2019, 141(4): 041001.

Paper No: EP-18-1031

DOI: https://doi.org/10.1115/1.4043406

Published Online: May 8, 2019

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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. March 2015, 137(1): 011005.

Paper No: EP-14-1012

DOI: https://doi.org/10.1115/1.4027995

Published Online: October 6, 2014

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Topics: Electronic packages, Energy generation, Generators, Heat flux, Junctions, Stress, Temperature, Waste heat, Transients (Dynamics)

Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. September 2013, 135(3): 031006.

Paper No: EP-13-1006

DOI: https://doi.org/10.1115/1.4024653

Published Online: June 24, 2013

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Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes

Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding

J. Electron. Packag. September 2009, 131(3): 031010.

DOI: https://doi.org/10.1115/1.3144147

Published Online: July 31, 2009

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Topics: Diffusion (Physics), Modeling, Temperature, Vapor pressure, Electronic packages

Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume

J. Electron. Packag. March 2009, 131(1): 011013.

DOI: https://doi.org/10.1115/1.3068301

Published Online: February 18, 2009

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Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection

Journal Articles

Integrating Compact Thermal Models in CFD Simulations of Electronic Packages

Rohit Dev Gupta, Vinayak Eswaran

J. Electron. Packag. June 2008, 130(2): 021002.

DOI: https://doi.org/10.1115/1.2837511

Published Online: April 15, 2008

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Topics: Computational fluid dynamics, Electronic packages, Flow (Dynamics), Junctions, Simulation, Temperature, Heat transfer, Computation, Heat, Boundary-value problems

Journal Articles

Submodeling Analysis for Path-Dependent Thermomechanical Problems

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. June 2005, 127(2): 135–140.

DOI: https://doi.org/10.1115/1.1869513

Published Online: September 28, 2004

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Topics: Fatigue, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Strips, Electronic packages

Journal Articles

The Moulded Electronic Package (MEP)

David J. J. Lowrie

J. Electron. Packag. March 2004, 126(1): 34–36.

DOI: https://doi.org/10.1115/1.1646424

Published Online: April 30, 2004

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Topics: Electronic packages, Circuits

Journal Articles

Three- and Four-Point Bend Testing for Electronic Packages

Santosh Shetty, Tommi Reinikainen

J. Electron. Packag. December 2003, 125(4): 556–561.

DOI: https://doi.org/10.1115/1.1604158

Published Online: December 15, 2003

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Topics: Printed circuit boards, Reliability, Simulation, Solder joints, Stress, Testing, Electronic packages, Failure

Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME

J. Electron. Packag. March 2003, 125(1): 18–23.

DOI: https://doi.org/10.1115/1.1520430

Published Online: March 14, 2003

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Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress

Journal Articles

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Sergey Shkarayev, Mem. ASME,, Sergey Savastiouk, Oleg Siniaguine

J. Electron. Packag. March 2003, 125(1): 98–103.

DOI: https://doi.org/10.1115/1.1535932

Published Online: March 14, 2003

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Topics: Design, Reliability, Stress, Electronic packages, Corners (Structural elements), Event history analysis, Solders

Journal Articles

Validation of Electronic Package Reliability Using Speckle Interferometry

H.-Y. Yeh, K. Cote

J. Electron. Packag. September 2002, 124(3): 277–280.

DOI: https://doi.org/10.1115/1.1478060

Published Online: July 26, 2002

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Topics: Creep, Displacement measurement, Electronic packages, Electronic speckle pattern interferometry, Interferometry, Reliability, Thermal expansion, Solder joints, Temperature, Cycles

Journal Articles

Applications of a Decomposed Analysis Procedure for Area-Array Packages

Terrace B. Thompson, Ganesh Subbarayan, Associate Professor

J. Electron. Packag. June 2001, 123(2): 132–140.

DOI: https://doi.org/10.1115/1.1339197

Published Online: September 14, 2000

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Topics: Displacement, Electronic packages, Errors, Finite element analysis, Optimization, Shear (Mechanics), Solder joints, Solders, Finite element model

Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,

J. Electron. Packag. September 2000, 122(3): 233–239.

DOI: https://doi.org/10.1115/1.1287928

Published Online: September 1, 2000

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Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions

Journal Articles

Handbook of Electronic Package Design

Michael Pecht,, Editor, Anthony J. Rafanelli,, Reviewer

J. Electron. Packag. June 2000, 122(2): 178–179.

DOI: https://doi.org/10.1115/1.483153

Published Online: June 1, 2000

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Topics: Design, Electronic packages, Thermal management, Printed circuit boards, Packaging

Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho

J. Electron. Packag. September 2001, 123(3): 196–199.

DOI: https://doi.org/10.1115/1.1347987

Published Online: March 21, 2000

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Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging

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Journal citation

NARROW

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Stress–Strain Behavior of SAC305 at High Strain Rates

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

3D Compact Model of Packaged Thermoelectric Coolers

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Integrating Compact Thermal Models in CFD Simulations of Electronic Packages

Submodeling Analysis for Path-Dependent Thermomechanical Problems

The Moulded Electronic Package (MEP)

Three- and Four-Point Bend Testing for Electronic Packages

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Validation of Electronic Package Reliability Using Speckle Interferometry

Applications of a Decomposed Analysis Procedure for Area-Array Packages

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

Handbook of Electronic Package Design

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

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