1-16 of 16
Electrodes
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging

Available to Purchase
Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021006.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: January 23, 2025
View Articletitled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
Open the PDF for Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging in another window
Topics: Batteries, Cycles, Simulation, Stress, Engineering simulation, Lithium-ion batteries, Electrodes
Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Free
Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Articletitled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Open the PDF for HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions in another window
Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Available to Purchase
Feifei Yan, Laili Wang, Yongmei Gan, Kaixuan Li, Boya Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031016.
Paper No: EP-21-1168
https://doi.org/10.1115/1.4053891
Published Online: March 11, 2022
View Articletitled, A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
Open the PDF for A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules in another window
Topics: Ceramics, Electric fields, Electrodes, Silicones, Insulation
Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Available to Purchase
Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
https://doi.org/10.1115/1.4047459
Published Online: June 23, 2020
View Articletitled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
Open the PDF for Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling in another window
Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields
Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Available to Purchase
Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
View Articletitled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
Open the PDF for Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications in another window
Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

Available to Purchase
Stephen H. Taylor, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
https://doi.org/10.1115/1.4028075
Published Online: September 19, 2014
View Articletitled, Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
Open the PDF for Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes in another window
Topics: Capacitance, Electrodes, Junctions, Network models, Sensors
Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Available to Purchase
Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
https://doi.org/10.1115/1.4026878
Published Online: September 19, 2014
View Articletitled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
Open the PDF for Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density in another window
Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation
Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Available to Purchase
Feng Gao, Jianmin Qu, Matthew Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020908.
https://doi.org/10.1115/1.4004095
Published Online: July 1, 2011
View Articletitled, Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
Open the PDF for Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations in another window
Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration
Journal Articles

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Available to Purchase
Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
https://doi.org/10.1115/1.4004220
Published Online: June 17, 2011
View Articletitled, A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
Open the PDF for A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials in another window
Topics: Carbon nanotubes, Electrodes
Journal Articles

Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

Available to Purchase
Y. Sungtaek Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
https://doi.org/10.1115/1.4002896
Published Online: November 23, 2010
View Articletitled, Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling
Open the PDF for Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling in another window
Topics: Cooling, Electrodes, Temperature, Thermal conductivity, Manufacturing
Journal Articles

Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

Available to Purchase
Yongho “Sungtaek” Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 109–114.
https://doi.org/10.1115/1.2165215
Published Online: December 5, 2005
View Articletitled, Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications
Open the PDF for Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications in another window
Topics: Electrodes, Heat, Junctions, Thermal resistance, Tunnels, Spintronics, Electrons, Heat conduction, Tunnel construction, Phonons
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Available to Purchase
Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Articletitled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
Open the PDF for Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation in another window
Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

Available to Purchase
A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Articletitled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
Open the PDF for Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors in another window
Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Available to Purchase
Wei Qin, Ira M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 212–219.
https://doi.org/10.1115/1.2905688
Published Online: September 1, 1994
View Articletitled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process
Open the PDF for Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process in another window
Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields
Journal Articles

Heat Transfer in Wire Bonding Process

Available to Purchase
M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Articletitled, Heat Transfer in Wire Bonding Process
Open the PDF for Heat Transfer in Wire Bonding Process in another window
Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Available to Purchase
Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
View Articletitled, Time-Dependent Ductility of Electro-Deposited Copper
Open the PDF for Time-Dependent Ductility of Electro-Deposited Copper in another window
Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size