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Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031006.
Paper No: EP-21-1025
https://doi.org/10.1115/1.4051647
Published Online: September 15, 2021
View Article titled, Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints
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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics
Journal Articles

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
https://doi.org/10.1115/1.4028516
Published Online: October 15, 2014
View Article titled, Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
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Topics: Durability, Excitation, Vibration, Inductors, Random vibration, Printed circuit boards, Electronic components, Failure
Journal Articles

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
https://doi.org/10.1115/1.3078195
Published Online: February 25, 2009
View Article titled, Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
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Topics: Durability, Excitation, Fatigue, Printed circuit boards, Solders, Vibration, Finite element analysis, Failure
Journal Articles

Damage Initiation and Propagation in Voided Joints: Modeling and Experiment

Leila Jannesari Ladani, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
https://doi.org/10.1115/1.2837562
Published Online: February 4, 2008
View Article titled, Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
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Topics: Damage, Finite element analysis, Modeling, Solders, Durability, Solder joints, Creep
Journal Articles

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
https://doi.org/10.1115/1.2753911
Published Online: September 8, 2006
View Article titled, Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
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Topics: Ball-Grid-Array packaging, Creep, Damage, Durability, Finite element analysis, Modeling, Solders, Thermomechanics, Reliability, Solder joints
Journal Articles

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

T. Zhang, S. Rahman, K. K. Choi, K. Cho, P. Baker, M. Shakil, D. Heitkamp
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
https://doi.org/10.1115/1.2721092
Published Online: July 5, 2006
View Article titled, A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems
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Topics: Deformation, Durability, Fatigue, Fatigue cracks, Fatigue life, Solder joints, Solders, Cycles, Fracture (Materials), Stress
Journal Articles

Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

Qian Zhang, Abhijit Dasgupta, Peter Haswell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 512–522.
https://doi.org/10.1115/1.2056569
Published Online: May 3, 2005
View Article titled, Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu
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Topics: Damage, Durability, Lead-free solders, Solders, Stress, Temperature, Tin, Solder joints
Journal Articles

Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis

Qian Zhang, Abhijit Dasgupta, Dave Nelson, Hector Pallavicini
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 415–429.
https://doi.org/10.1115/1.2098812
Published Online: January 6, 2005
View Article titled, Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis
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Topics: Durability, Finite element analysis, Solder joints, Solders, Thermomechanics, Stress, Damage, Cycles, Vehicles, Lead-free solders
Journal Articles

Engineering of Superconductive Ceramics

Anatoly E. Rokhvarger, Lubov A. Chigirinsky
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 26–33.
https://doi.org/10.1115/1.1646423
Published Online: April 30, 2004
View Article titled, Engineering of Superconductive Ceramics
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Topics: Ceramics, Nanotechnology, Silver, Wire, Adhesion, Durability, Crystals, Copper, Temperature
Journal Articles

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

John E. Ritter, G. S. Jacome, J. R. Pelch, T. P. Russell, T. J. Lardner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 328–333.
https://doi.org/10.1115/1.1503064
Published Online: December 12, 2002
View Article titled, Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces
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Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Glass, Stress corrosion cracking, Water, Fatigue cracks, Durability
Journal Articles

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
https://doi.org/10.1115/1.1477193
Published Online: July 26, 2002
View Article titled, Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects
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Topics: Durability, Intermetallic compounds, Stress, Finite element analysis, Life testing, Solder joints, Failure, Temperature
Journal Articles

Thermomechanical Durability of High I/O BGA Packages

P. Davuluri, S. Shetty, A. Dasgupta, S. Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 266–270.
https://doi.org/10.1115/1.1477192
Published Online: July 26, 2002
View Article titled, Thermomechanical Durability of High I/O BGA Packages
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Topics: Ball-Grid-Array packages, Cycles, Durability, Failure, Modeling, Solder joints, Solders, Stress, Stress analysis (Engineering), Thermomechanics
Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Pradeep Sharma, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 298–304.
https://doi.org/10.1115/1.1493203
Published Online: July 26, 2002
View Article titled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
Open the PDF for Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data in another window
Topics: Creep, Cycles, Damage, Durability, Failure, Fatigue, Grain size, Hydrostatics, Micromechanics (Engineering), Solders
Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Krishna Darbha, Abhijit Dasgupta, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 147–155.
https://doi.org/10.1115/1.1328745
Published Online: October 10, 2000
View Article titled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects
Open the PDF for A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects in another window
Topics: Ball-Grid-Array packaging, Creep, Finite element analysis, Flip-chip devices, Manufacturing, Solders, Stress, Stress analysis (Engineering), Durability, Temperature
Journal Articles

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 302–308.
https://doi.org/10.1115/1.1362673
Published Online: March 25, 2000
View Article titled, Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending
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Topics: Cycles, Failure, Fatigue, Fatigue testing, Finite element analysis, Solder joints, Stress, Durability, Fatigue life
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

K. Darbha, J. H. Okura, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 231–236.
https://doi.org/10.1115/1.2793845
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill
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Topics: Durability, Flip-chip devices, Solders, Thermomechanics, Flip-chip, Damage, Stress, Stress analysis (Engineering), Finite element model, Modeling
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 237–241.
https://doi.org/10.1115/1.2793846
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
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Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles
Journal Articles

Bus Bar Solder Joint Durability Evaluation

T. Eric Wong, Harold M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 80–86.
https://doi.org/10.1115/1.2792136
Published Online: June 1, 1996
View Article titled, Bus Bar Solder Joint Durability Evaluation
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Topics: Durability, Solder joints, Damage, Military aircraft, Reliability, Temperature, Computers, Electronic packaging, Failure, Fatigue life
Journal Articles

Indentation Method to Measure Plating Ductility

P. A. Engel, D. L. Questad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 272–277.
https://doi.org/10.1115/1.2904378
Published Online: September 1, 1990
View Article titled, Indentation Method to Measure Plating Ductility
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Topics: Ductility, Plating, Fracture (Materials), Displacement, Durability, Electron microscopy, X-rays