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Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

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Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
https://doi.org/10.1115/1.4032493
Published Online: March 10, 2016
View Articletitled, Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping
Journal Articles

Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability

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J. F. Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
https://doi.org/10.1115/1.4027338
Published Online: April 29, 2014
View Articletitled, Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
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Topics: Design, Dimensions, Heat sinks, Heat transfer, Ducts, Microchannels, Cooling
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

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Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Articletitled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
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Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

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Hiroshi Honda, ZhengGuo Zhang, Nobuo Takata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
https://doi.org/10.1115/1.1772412
Published Online: October 6, 2004
View Articletitled, Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
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Topics: Boiling, Critical heat flux, Electronic components, Flow (Dynamics), Heat transfer, Pool boiling, Ducts, Condensers (steam plant), Heat flux, Cooling
Journal Articles

Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

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J. Y. Chang, C. W. Yu, R. L. Webb
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 225–231.
https://doi.org/10.1115/1.1348012
Published Online: October 11, 2000
View Articletitled, Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
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Topics: Air flow, Computational fluid dynamics, Computers, Design, Heat sinks, Temperature, Ducts, Vents, Modeling, Computer simulation
Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

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Y. Asako, Y. Yamaguchi, M. Faghri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 202–208.
https://doi.org/10.1115/1.2792685
Published Online: September 1, 1999
View Articletitled, Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
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Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number
Journal Articles

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

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A. Gupta, Y. Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 243–252.
https://doi.org/10.1115/1.2792629
Published Online: September 1, 1998
View Articletitled, Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct
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Topics: Cooling, Ducts, Heat, Reynolds number, Heat transfer, Water, Algebra, Buoyancy, Flow (Dynamics), Flow visualization
Journal Articles

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

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Ann M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 310–316.
https://doi.org/10.1115/1.2905703
Published Online: December 1, 1994
View Articletitled, Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
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Topics: Heat transfer, Heat transfer coefficients, Convection, Heat conduction, Temperature, Radiation (Physics), Computation, Computer cooling, Ducts, Errors
Journal Articles

An Experimental Investigation of a Staggered Array of Heatsinks in the Hydrodynamic and Thermal Entrance Regions of a Duct

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Sarah M. Bazydola, Mohammad E. Taslim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 106–111.
https://doi.org/10.1115/1.2909288
Published Online: March 1, 1993
View Articletitled, An Experimental Investigation of a Staggered Array of Heatsinks in the Hydrodynamic and Thermal Entrance Regions of a Duct
Open the PDF for An Experimental Investigation of a Staggered Array of Heatsinks in the Hydrodynamic and Thermal Entrance Regions of a Duct in another window
Topics: Ducts, Entrance region, Reynolds number, Electronic packages, Temperature, Computers, Design, Heat transfer coefficients, Printed circuit boards
Journal Articles

Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects

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G. L. Lehmann, J. Pembroke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 27–32.
https://doi.org/10.1115/1.2905363
Published Online: March 1, 1991
View Articletitled, Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects
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Topics: Cooling, Electronic components, Forced convection, Heat sinks, Flow (Dynamics), Heat transfer, Reynolds number, Ducts, Turbulence, Turbulent heat transfer