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Journal Articles
Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
Available to PurchaseGerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
Published Online: March 10, 2016
Journal Articles
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
Published Online: April 29, 2014
Journal Articles
Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
Journal Articles
Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
Published Online: October 6, 2004
Journal Articles
Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 225–231.
Published Online: October 11, 2000
Journal Articles
Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 202–208.
Published Online: September 1, 1999
Journal Articles
Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 243–252.
Published Online: September 1, 1998
Journal Articles
Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 310–316.
Published Online: December 1, 1994
Journal Articles
An Experimental Investigation of a Staggered Array of Heatsinks in the Hydrodynamic and Thermal Entrance Regions of a Duct
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 106–111.
Published Online: March 1, 1993
Journal Articles
Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 27–32.
Published Online: March 1, 1991