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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen

J. Electron. Packag. March 2023, 145(1): 011205.

Paper No: EP-22-1001

DOI: https://doi.org/10.1115/1.4054821

Published Online: August 3, 2022

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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders

Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017.

Paper No: EP-21-1014

DOI: https://doi.org/10.1115/1.4054183

Published Online: April 22, 2022

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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress

Includes: Supplementary data

Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2022, 144(4): 041019.

Paper No: EP-21-1161

DOI: https://doi.org/10.1115/1.4054263

Published Online: April 22, 2022

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Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity

Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106.

Paper No: EP-21-1010

DOI: https://doi.org/10.1115/1.4052070

Published Online: October 6, 2021

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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping

Journal Articles

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi

J. Electron. Packag. September 2022, 144(3): 031001.

Paper No: EP-20-1111

DOI: https://doi.org/10.1115/1.4051620

Published Online: September 15, 2021

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Topics: Fatigue, Solder joints, Stiffness, Stress, Temperature, Failure, Deformation, Manufacturing, Shear (Mechanics)

Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. September 2022, 144(3): 031009.

Paper No: EP-21-1076

DOI: https://doi.org/10.1115/1.4051728

Published Online: September 15, 2021

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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun

J. Electron. Packag. September 2021, 143(3): 031002.

Paper No: EP-20-1047

DOI: https://doi.org/10.1115/1.4049128

Published Online: January 19, 2021

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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation

Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee

J. Electron. Packag. June 2021, 143(2): 020802.

Paper No: EP-20-1043

DOI: https://doi.org/10.1115/1.4048011

Published Online: September 3, 2020

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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings

Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao

J. Electron. Packag. June 2020, 142(2): 021005.

Paper No: EP-19-1105

DOI: https://doi.org/10.1115/1.4046164

Published Online: February 19, 2020

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Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure

Journal Articles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu

J. Electron. Packag. March 2020, 142(1): 011009.

Paper No: EP-19-1058

DOI: https://doi.org/10.1115/1.4044648

Published Online: October 10, 2019

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Topics: Grain size, Shear (Mechanics), Simulation, Deformation, Reliability, Atoms, Simulation results, Copper

Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

J. Electron. Packag. March 2018, 140(1): 010906.

Paper No: EP-17-1101

DOI: https://doi.org/10.1115/1.4039027

Published Online: March 2, 2018

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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing

Journal Articles

Stretchable Thin Film Materials: Fabrication, Application, and Mechanics

Yu Wang, Zhengwei Li, Jianliang Xiao

J. Electron. Packag. June 2016, 138(2): 020801.

Paper No: EP-15-1122

DOI: https://doi.org/10.1115/1.4032984

Published Online: April 18, 2016

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Topics: Buckling, Manufacturing, Thin films, Deformation, Plasma desorption mass spectrometry, Electronics, Design

Journal Articles

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Abas Abdoli, George S. Dulikravich, Genesis Vasquez, Siavash Rastkar

J. Electron. Packag. September 2015, 137(3): 031003.

Paper No: EP-14-1061

DOI: https://doi.org/10.1115/1.4030005

Published Online: September 1, 2015

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Topics: Cooling, Design, Microchannels, Stress, Heat flux, Deformation, Fluids, Heat transfer, Temperature, Heat

Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

R. W. Johnson, Y.-L. Shen

J. Electron. Packag. June 2015, 137(2): 021011.

Paper No: EP-14-1045

DOI: https://doi.org/10.1115/1.4029345

Published Online: June 1, 2015

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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation

Journal Articles

Study of Electromigration-Induced Stress of Solder

Fei Su, Zheng Zhang, Yuan Wang, Weijia Li

J. Electron. Packag. June 2015, 137(2): 021006.

Paper No: EP-14-1025

DOI: https://doi.org/10.1115/1.4029463

Published Online: June 1, 2015

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Topics: Deformation, Electrodiffusion, Finite element methods, Solders, Stress

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Fuliang Wang, Weidong Tang, Junhui Li, Lei Han

J. Electron. Packag. December 2013, 135(4): 041004.

Paper No: EP-12-1061

DOI: https://doi.org/10.1115/1.4025308

Published Online: September 19, 2013

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Topics: Springs, Wire, Wire bonding, Deformation

Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea

J. Electron. Packag. December 2012, 134(4): 041007.

DOI: https://doi.org/10.1115/1.4007812

Published Online: November 26, 2012

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Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems

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Journal citation

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Supplemental Material

Effective Constitutive Relations for Sintered Nano Copper Joints

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Stretchable Thin Film Materials: Fabrication, Application, and Mechanics

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

Study of Electromigration-Induced Stress of Solder

Stress–Strain Behavior of SAC305 at High Strain Rates

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

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