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Journal Articles

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Free
Geoffrey A. Garcia, Kody Wakumoto, Joseph J. Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041004.
Paper No: EP-21-1018
https://doi.org/10.1115/1.4052325
Published Online: November 22, 2021
View Articletitled, Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
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Topics: Cantilevers, Design, Deflection, Microfabrication, Metamaterials, Modeling, Finite element analysis, Stress
Journal Articles

Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test

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M. Y. Tsai, H. Y. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031002.
Paper No: EP-20-1125
https://doi.org/10.1115/1.4051256
Published Online: September 15, 2021
View Articletitled, Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test
Open the PDF for Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test in another window
Topics: Bending strength, Silicon, Stress, Fittings, Deflection
Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

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Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031008.
Paper No: EP-20-1100
https://doi.org/10.1115/1.4049577
Published Online: February 19, 2021
View Articletitled, Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
Open the PDF for Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules in another window
Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

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Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Articletitled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Free
Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041001.
Paper No: EP-17-1120
https://doi.org/10.1115/1.4040552
Published Online: July 3, 2018
View Articletitled, Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design
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Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties
Journal Articles

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

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Huang-Kuang Kung, Chi-Lung Hsieh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
https://doi.org/10.1115/1.4037276
Published Online: July 27, 2017
View Articletitled, Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
Open the PDF for Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages in another window
Topics: Wire, Deflection
Journal Articles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

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Kenny Mahan, David Rosen, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041003.
Paper No: EP-16-1046
https://doi.org/10.1115/1.4034454
Published Online: September 2, 2016
View Articletitled, Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
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Topics: Adhesion, Deflection, Pressure, Testing, Polymer films, Copper, Delamination
Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

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Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
https://doi.org/10.1115/1.4032497
Published Online: March 10, 2016
View Articletitled, Analytical Solution for Electronic Assemblies Under Vibration
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Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis
Journal Articles

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

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J. J. M. Zaal, W. D. van Driel, F. J. H. G. Kessels, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
https://doi.org/10.1115/1.3068311
Published Online: February 12, 2009
View Articletitled, Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements
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Topics: Impact testing, Reliability, Simulation, Solders, Testing, Deflection, Damping
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

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Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Articletitled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

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Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 236–246.
https://doi.org/10.1115/1.2721080
Published Online: July 25, 2006
View Articletitled, Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors
Open the PDF for Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors in another window
Topics: Design, Engineering prototypes, Modeling, Optimization, Testing, Displacement, Manufacturing, Deflection, Wear
Journal Articles

Test Methods for Silicon Die Strength

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M. Y. Tsai, C. H. Chen, C. S. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
https://doi.org/10.1115/1.2351907
Published Online: February 6, 2006
View Articletitled, Test Methods for Silicon Die Strength
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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

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K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Articletitled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

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Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Articletitled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Dynamics Of Board-Level Drop Impact

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E. H. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
https://doi.org/10.1115/1.1938987
Published Online: July 17, 2004
View Articletitled, Dynamics Of Board-Level Drop Impact
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Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing
Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

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John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
https://doi.org/10.1115/1.1604807
Published Online: December 15, 2003
View Articletitled, Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses
Journal Articles

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

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Hideo Koguchi, Chie Sasaki, Kazuto Nishida
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 414–419.
https://doi.org/10.1115/1.1602705
Published Online: September 17, 2003
View Articletitled, Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
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Topics: Deflection, Temperature, Finite element methods, Plates (structures)
Journal Articles

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

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Yibin Xue, Vivek A. Jairazbhoy, Xiaoting Niu, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 53–58.
https://doi.org/10.1115/1.1527892
Published Online: March 14, 2003
View Articletitled, Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending
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Topics: Boundary-value problems, Deflection, Deformation, Finite element analysis, Plates (structures)
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

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J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
View Articletitled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
Open the PDF for Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch in another window
Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis
Journal Articles

Could Shock Tests Adequately Mimic Drop Test Conditions?

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E. Suhir, ASME Fellow
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
https://doi.org/10.1115/1.1487356
Published Online: July 26, 2002
View Articletitled, Could Shock Tests Adequately Mimic Drop Test Conditions?
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Topics: Dynamic response, Impulse (Physics), Shock (Mechanics), Vibration, Stress, Life testing, Deflection