Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 47

2 3

Sort by

Sort Order Select

Journal Articles

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Geoffrey A. Garcia, Kody Wakumoto, Joseph J. Brown

J. Electron. Packag. December 2022, 144(4): 041004.

Paper No: EP-21-1018

DOI: https://doi.org/10.1115/1.4052325

Published Online: November 22, 2021

View Article

Topics: Cantilevers, Design, Deflection, Microfabrication, Metamaterials, Modeling, Finite element analysis, Stress

Journal Articles

Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test

M. Y. Tsai, H. Y. Liu

J. Electron. Packag. September 2022, 144(3): 031002.

Paper No: EP-20-1125

DOI: https://doi.org/10.1115/1.4051256

Published Online: September 15, 2021

View Article

Topics: Bending strength, Silicon, Stress, Fittings, Deflection

Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani

J. Electron. Packag. September 2021, 143(3): 031008.

Paper No: EP-20-1100

DOI: https://doi.org/10.1115/1.4049577

Published Online: February 19, 2021

View Article

Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes

Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm

J. Electron. Packag. December 2018, 140(4): 041004.

Paper No: EP-17-1062

DOI: https://doi.org/10.1115/1.4040923

Published Online: August 20, 2018

View Article

Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders

Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell

J. Electron. Packag. December 2018, 140(4): 041001.

Paper No: EP-17-1120

DOI: https://doi.org/10.1115/1.4040552

Published Online: July 3, 2018

View Article

Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties

Journal Articles

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Huang-Kuang Kung, Chi-Lung Hsieh

J. Electron. Packag. December 2017, 139(4): 041002.

Paper No: EP-17-1042

DOI: https://doi.org/10.1115/1.4037276

Published Online: July 27, 2017

View Article

Topics: Wire, Deflection

Journal Articles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Kenny Mahan, David Rosen, Bongtae Han

J. Electron. Packag. December 2016, 138(4): 041003.

Paper No: EP-16-1046

DOI: https://doi.org/10.1115/1.4034454

Published Online: September 2, 2016

View Article

Topics: Adhesion, Deflection, Pressure, Testing, Polymer films, Copper, Delamination

Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi

J. Electron. Packag. March 2016, 138(1): 011003.

Paper No: EP-15-1113

DOI: https://doi.org/10.1115/1.4032497

Published Online: March 10, 2016

View Article

Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis

Journal Articles

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

J. J. M. Zaal, W. D. van Driel, F. J. H. G. Kessels, G. Q. Zhang

J. Electron. Packag. March 2009, 131(1): 011007.

DOI: https://doi.org/10.1115/1.3068311

Published Online: February 12, 2009

View Article

Topics: Impact testing, Reliability, Simulation, Solders, Testing, Deflection, Damping

Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao

J. Electron. Packag. September 2007, 129(3): 266–272.

DOI: https://doi.org/10.1115/1.2753910

Published Online: March 15, 2007

View Article

Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis

Journal Articles

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell

J. Electron. Packag. September 2007, 129(3): 236–246.

DOI: https://doi.org/10.1115/1.2721080

Published Online: July 25, 2006

View Article

Topics: Design, Engineering prototypes, Modeling, Optimization, Testing, Displacement, Manufacturing, Deflection, Wear

Journal Articles

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin

J. Electron. Packag. December 2006, 128(4): 419–426.

DOI: https://doi.org/10.1115/1.2351907

Published Online: February 6, 2006

View Article

Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis

Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang

J. Electron. Packag. December 2005, 127(4): 530–536.

DOI: https://doi.org/10.1115/1.2070092

Published Online: December 22, 2004

View Article

Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics

Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang

J. Electron. Packag. September 2005, 127(3): 324–334.

DOI: https://doi.org/10.1115/1.1938986

Published Online: December 2, 2004

View Article

Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding

Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong

J. Electron. Packag. September 2005, 127(3): 200–207.

DOI: https://doi.org/10.1115/1.1938987

Published Online: July 17, 2004

View Article

Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing

Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou

J. Electron. Packag. December 2003, 125(4): 602–608.

DOI: https://doi.org/10.1115/1.1604807

Published Online: December 15, 2003

View Article

Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses

Journal Articles

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Hideo Koguchi, Chie Sasaki, Kazuto Nishida

J. Electron. Packag. September 2003, 125(3): 414–419.

DOI: https://doi.org/10.1115/1.1602705

Published Online: September 17, 2003

View Article

Topics: Deflection, Temperature, Finite element methods, Plates (structures)

Journal Articles

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

Yibin Xue, Vivek A. Jairazbhoy, Xiaoting Niu, Jianmin Qu, Fellow ASME

J. Electron. Packag. March 2003, 125(1): 53–58.

DOI: https://doi.org/10.1115/1.1527892

Published Online: March 14, 2003

View Article

Topics: Boundary-value problems, Deflection, Deformation, Finite element analysis, Plates (structures)

Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan

J. Electron. Packag. December 2002, 124(4): 403–410.

DOI: https://doi.org/10.1115/1.1512294

Published Online: December 12, 2002

View Article

Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis

Journal Articles

Effective Local Flexural Stiffness of Ball Grid Array Assemblies

Jung-Chuan Lee, Mem. ASME, Mostafa Rassaian, Mem. ASME

J. Electron. Packag. September 2002, 124(3): 192–197.

DOI: https://doi.org/10.1115/1.1463733

Published Online: July 26, 2002

View Article

Topics: Ball-Grid-Array packaging, Displacement, Stiffness, Finite element methods, Deflection, Printed circuit boards, Stress

2 3

Journal citation

NARROW

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Analytical Solution for Electronic Assemblies Under Vibration

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Test Methods for Silicon Die Strength

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

Three-Dimensional Paddle Shift Modeling for IC Packaging

Dynamics Of Board-Level Drop Impact

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

Effective Local Flexural Stiffness of Ball Grid Array Assemblies

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only