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Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

DOI: https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. March 2023, 145(1): 011102.

Paper No: EP-22-1016

DOI: https://doi.org/10.1115/1.4055394

Published Online: September 27, 2022

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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature

Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. September 2022, 144(3): 031009.

Paper No: EP-21-1076

DOI: https://doi.org/10.1115/1.4051728

Published Online: September 15, 2021

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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. June 2022, 144(2): 021102.

Paper No: EP-21-1053

DOI: https://doi.org/10.1115/1.4052231

Published Online: September 13, 2021

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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress

Journal Articles

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Chang-Chun Lee, Kuo-Shu Kao, Hou-Chun Liu, Chia-Ping Hsieh, Tao-Chih Chang

J. Electron. Packag. March 2022, 144(1): 011001.

Paper No: EP-20-1071

DOI: https://doi.org/10.1115/1.4050198

Published Online: August 6, 2021

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Topics: Creep, Fatigue, Packaging, Reliability, Solder joints, Warping, Finite element analysis, Stress, Solders, Silicon

Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

John H. Lau

J. Electron. Packag. June 2021, 143(2): 020803.

Paper No: EP-20-1059

DOI: https://doi.org/10.1115/1.4048037

Published Online: September 3, 2020

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Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress

Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama

J. Electron. Packag. June 2021, 143(2): 020801.

Paper No: EP-20-1074

DOI: https://doi.org/10.1115/1.4048038

Published Online: August 27, 2020

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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire

Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu

J. Electron. Packag. March 2021, 143(1): 011001.

Paper No: EP-19-1055

DOI: https://doi.org/10.1115/1.4047227

Published Online: June 4, 2020

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Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model

Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen

J. Electron. Packag. March 2020, 142(1): 011007.

Paper No: EP-19-1042

DOI: https://doi.org/10.1115/1.4044489

Published Online: October 10, 2019

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Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results

Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha

J. Electron. Packag. December 2019, 141(4): 040802.

Paper No: EP-18-1117

DOI: https://doi.org/10.1115/1.4043405

Published Online: May 17, 2019

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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders

Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng

J. Electron. Packag. March 2019, 141(1): 010801.

Paper No: EP-18-1046

DOI: https://doi.org/10.1115/1.4042800

Published Online: February 25, 2019

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Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep

Journal Articles

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Joel Thambi, Andreas Schiessl, Manuela Waltz, Klaus-Dieter Lang, Ulrich Tetzlaff

J. Electron. Packag. September 2017, 139(3): 031002.

Paper No: EP-16-1064

DOI: https://doi.org/10.1115/1.4035850

Published Online: June 14, 2017

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Topics: Alloys, Creep, Stress, Temperature, Tin, Modeling

Journal Articles

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Subhasis Mukherjee, Mohammed Nuhi, Abhijit Dasgupta, Mohammad Modarres

J. Electron. Packag. September 2016, 138(3): 030801.

Paper No: EP-15-1143

DOI: https://doi.org/10.1115/1.4033375

Published Online: June 8, 2016

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Topics: Creep, Solders, Tin, Constitutive equations

Journal Articles

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen

J. Electron. Packag. June 2016, 138(2): 021001.

Paper No: EP-15-1109

DOI: https://doi.org/10.1115/1.4032880

Published Online: March 23, 2016

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Topics: Fatigue, Fracture (Materials), Shear (Mechanics), Shear stress, Temperature, Creep, Fracture (Process), Fatigue life, Cycles

Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani

J. Electron. Packag. December 2015, 137(4): 041003.

Paper No: EP-14-1099

DOI: https://doi.org/10.1115/1.4031523

Published Online: September 25, 2015

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Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller

J. Electron. Packag. September 2012, 134(3): 031002.

DOI: https://doi.org/10.1115/1.4006927

Published Online: July 18, 2012

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Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing

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Journal citation

NARROW

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Effective Constitutive Relations for Sintered Nano Copper Joints

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

State of the Art of Lead-Free Solder Joint Reliability

Review of Methodologies for Structural Integrity Evaluation of Power Modules

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Special Section on InterPACK 2013

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

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