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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007.

Paper No: EP-22-1070

DOI: https://doi.org/10.1115/1.4056886

Published Online: March 7, 2023

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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress

Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011002.

Paper No: EP-19-1029

DOI: https://doi.org/10.1115/1.4044218

Published Online: August 1, 2019

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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints

Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas

J. Electron. Packag. March 2012, 134(1): 011010.

DOI: https://doi.org/10.1115/1.4005904

Published Online: March 19, 2012

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Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)

Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou

J. Electron. Packag. March 2012, 134(1): 011011.

DOI: https://doi.org/10.1115/1.4005956

Published Online: March 19, 2012

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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin

Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong

J. Electron. Packag. September 2005, 127(3): 200–207.

DOI: https://doi.org/10.1115/1.1938987

Published Online: July 17, 2004

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Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing

Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

J. Electron. Packag. June 2004, 126(2): 202–207.

DOI: https://doi.org/10.1115/1.1756143

Published Online: July 8, 2004

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Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)

Journal Articles

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim

J. Electron. Packag. December 2003, 125(4): 569–575.

DOI: https://doi.org/10.1115/1.1604803

Published Online: December 15, 2003

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Topics: Boundary element methods, Delamination, Fracture (Materials), Stress, Corners (Structural elements), Stress analysis (Engineering)

Journal Articles

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn

J. Electron. Packag. September 2003, 125(3): 369–377.

DOI: https://doi.org/10.1115/1.1602702

Published Online: September 17, 2003

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Topics: Corners (Structural elements), Fracture (Materials), Fracture (Process), Gallium arsenide, Geometry, Solders, Stress, Brittleness, Temperature, Finite element analysis

Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato

J. Electron. Packag. March 2003, 125(1): 31–38.

DOI: https://doi.org/10.1115/1.1525244

Published Online: March 14, 2003

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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods

Journal Articles

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Sergey Shkarayev, Mem. ASME,, Sergey Savastiouk, Oleg Siniaguine

J. Electron. Packag. March 2003, 125(1): 98–103.

DOI: https://doi.org/10.1115/1.1535932

Published Online: March 14, 2003

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Topics: Design, Reliability, Stress, Electronic packages, Corners (Structural elements), Event history analysis, Solders

Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener

J. Electron. Packag. September 2002, 124(3): 198–204.

DOI: https://doi.org/10.1115/1.1481894

Published Online: July 26, 2002

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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks

Journal Articles

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang

J. Electron. Packag. September 2002, 124(3): 212–220.

DOI: https://doi.org/10.1115/1.1462625

Published Online: July 26, 2002

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Topics: Corners (Structural elements), Fracture (Materials), Solder joints, Fatigue, Density, Semiconductor wafers, Cycles

Journal Articles

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang

J. Electron. Packag. June 2002, 124(2): 69–76.

DOI: https://doi.org/10.1115/1.1400995

Published Online: May 2, 2002

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Topics: Creep, Solder joints, Lead-free solders, Solders, Shear (Mechanics), Corners (Structural elements), Shear stress, Stress, Printed circuit board assemblies, Reliability

Journal Articles

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Chia-Yu Fu, David L. McDowell, I. Charles Ume

J. Electron. Packag. March 2002, 124(1): 45–53.

DOI: https://doi.org/10.1115/1.1401737

Published Online: January 1, 2001

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Topics: Cooling, Corners (Structural elements), Finite element analysis, Printed circuit boards, Stress, Stress analysis (Engineering), Temperature, Transients (Dynamics), Wave soldering, Copper

Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied

J. Electron. Packag. December 2000, 122(4): 301–305.

DOI: https://doi.org/10.1115/1.1289768

Published Online: December 1, 2000

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Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry

Journal Articles

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member

J. Electron. Packag. December 2000, 122(4): 306–310.

DOI: https://doi.org/10.1115/1.1289998

Published Online: June 20, 2000

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Topics: Corners (Structural elements), Delamination, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture mechanics, Solder joints, Solder masks, Solders, Stress

Journal Articles

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member, Chris Chang

J. Electron. Packag. December 2000, 122(4): 311–316.

DOI: https://doi.org/10.1115/1.1289769

Published Online: May 29, 2000

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Topics: Corners (Structural elements), Creep, Semiconductor wafers, Shear (Mechanics), Solder joints, Solders, Temperature, Finite element analysis, Reliability, Manufacturing

Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´

J. Electron. Packag. December 1998, 120(4): 360–366.

DOI: https://doi.org/10.1115/1.2792647

Published Online: December 1, 1998

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Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods

Journal Articles

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu

J. Electron. Packag. June 1998, 120(2): 179–185.

DOI: https://doi.org/10.1115/1.2792617

Published Online: June 1, 1998

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Topics: Creep, Finite element methods, Flip-chip packages, Interferometry, Modeling, Deformation, Displacement, Solders, Stress, Finite element analysis

Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

J. Electron. Packag. March 1998, 120(1): 18–23.

DOI: https://doi.org/10.1115/1.2792279

Published Online: March 1, 1998

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Journal citation

NARROW

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Dynamics Of Board-Level Drop Impact

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

Shearing Deformation in Partial Areal Arrays: Analytical Results

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