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Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic

J. Electron. Packag. March 2023, 145(1): 011105.

Paper No: EP-22-1022

DOI: https://doi.org/10.1115/1.4056031

Published Online: November 11, 2022

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Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling

Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink

J. Electron. Packag. March 2023, 145(1): 011101.

Paper No: EP-22-1023

DOI: https://doi.org/10.1115/1.4055464

Published Online: September 27, 2022

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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors

Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour

J. Electron. Packag. September 2022, 144(3): 031015.

Paper No: EP-21-1151

DOI: https://doi.org/10.1115/1.4053890

Published Online: March 8, 2022

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling

Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011.

Paper No: EP-21-1119

DOI: https://doi.org/10.1115/1.4053310

Published Online: January 28, 2022

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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

J. Electron. Packag. December 2022, 144(4): 041008.

Paper No: EP-21-1115

DOI: https://doi.org/10.1115/1.4052324

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop

Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur

J. Electron. Packag. December 2021, 143(4): 041109.

Paper No: EP-21-1087

DOI: https://doi.org/10.1115/1.4052814

Published Online: November 5, 2021

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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state

Includes: Supplementary data

Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108.

Paper No: EP-21-1037

DOI: https://doi.org/10.1115/1.4052711

Published Online: November 2, 2021

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Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing

Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 021109.

Paper No: EP-21-1016

DOI: https://doi.org/10.1115/1.4052536

Published Online: October 14, 2021

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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables

Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106.

Paper No: EP-21-1120

DOI: https://doi.org/10.1115/1.4052465

Published Online: October 13, 2021

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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors

Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed

J. Electron. Packag. December 2022, 144(4): 041002.

Paper No: EP-21-1044

DOI: https://doi.org/10.1115/1.4052101

Published Online: October 6, 2021

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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty

Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye

J. Electron. Packag. September 2022, 144(3): 030802.

Paper No: EP-20-1109

DOI: https://doi.org/10.1115/1.4051970

Published Online: October 1, 2021

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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo

J. Electron. Packag. September 2022, 144(3): 031010.

Paper No: EP-21-1079

DOI: https://doi.org/10.1115/1.4051754

Published Online: September 15, 2021

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Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)

Includes: Supplementary data

Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2021, 143(4): 041103.

Paper No: EP-21-1083

DOI: https://doi.org/10.1115/1.4051943

Published Online: August 27, 2021

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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling

Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess

J. Electron. Packag. December 2021, 143(4): 041101.

Paper No: EP-21-1034

DOI: https://doi.org/10.1115/1.4051752

Published Online: August 9, 2021

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Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability

Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller

J. Electron. Packag. March 2022, 144(1): 011004.

Paper No: EP-20-1093

DOI: https://doi.org/10.1115/1.4049815

Published Online: August 6, 2021

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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature

Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan

J. Electron. Packag. March 2022, 144(1): 010801.

Paper No: EP-20-1113

DOI: https://doi.org/10.1115/1.4050002

Published Online: August 6, 2021

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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state

Journal Articles

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Ruina Xu, Gaoyuan Wang, Peixue Jiang

J. Electron. Packag. March 2022, 144(1): 010802.

Paper No: EP-20-1114

DOI: https://doi.org/10.1115/1.4050046

Published Online: August 6, 2021

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Topics: Cooling, Heat transfer, Sprays, Critical heat flux, Drops

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Journal citation

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Supplemental Material

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Recent Developments in Air Pumps for Thermal Management of Electronics

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

A Review on Transient Thermal Management of Electronic Devices

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

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