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Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011206.
Paper No: EP-22-1010
https://doi.org/10.1115/1.4054822
Published Online: August 3, 2022
View Article titled, Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
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Topics: Shock (Mechanics), Contact resistance, Displacement
Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
https://doi.org/10.1115/1.4053121
Published Online: February 7, 2022
View Article titled, Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance
Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Article titled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
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Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Sung Woo Ma, Chanho Shin, Young-Ho Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041004.
Paper No: EP-17-1044
https://doi.org/10.1115/1.4037474
Published Online: September 5, 2017
View Article titled, Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps
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Topics: Bonding, Contact resistance, Electrodiffusion, Shear strength, Temperature, Heating, Joules
Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011001.
https://doi.org/10.1115/1.4005955
Published Online: March 19, 2012
View Article titled, A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact
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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)
Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020908.
https://doi.org/10.1115/1.4004095
Published Online: July 1, 2011
View Article titled, Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
Open the PDF for Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations in another window
Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration
Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Article titled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Open the PDF for Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film in another window
Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
https://doi.org/10.1115/1.4002724
Published Online: November 24, 2010
View Article titled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Article titled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields
Journal Articles

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Zongrong Liu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 319–323.
https://doi.org/10.1115/1.2351895
Published Online: June 1, 2006
View Article titled, Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material
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Topics: Boron, Contact resistance, Paraffin wax, Particulate matter, Pressure, Temperature, Thermal conductivity, Electrical conductance, Copper
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
https://doi.org/10.1115/1.2227057
Published Online: August 7, 2005
View Article titled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip
Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
https://doi.org/10.1115/1.1849236
Published Online: June 3, 2005
View Article titled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
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Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing
Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
https://doi.org/10.1115/1.2056570
Published Online: February 14, 2005
View Article titled, Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
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Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion
Journal Articles

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 386–391.
https://doi.org/10.1115/1.1602703
Published Online: September 17, 2003
View Article titled, Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
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Topics: Contact resistance, Particulate matter, Thermal conductivity, Percolation theory, Stiffness, Modeling, Polymers, Fillers (Materials)
Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 186–191.
https://doi.org/10.1115/1.1568126
Published Online: June 10, 2003
View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
Open the PDF for Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces in another window
Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics
Journal Articles

In Honor of Dr. M. M. Yovanovich

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
https://doi.org/10.1115/1.1568123
Published Online: June 10, 2003
View Article titled, In Honor of Dr. M. M. Yovanovich
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Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling
Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 192–199.
https://doi.org/10.1115/1.1568127
Published Online: June 10, 2003
View Article titled, Thermal Interfacing Techniques for Electronic Equipment—A Perspective
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Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer