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Journal Articles

Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

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Hui Xiong, Liaoxin Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041101.
Paper No: EP-19-1128
https://doi.org/10.1115/1.4047190
Published Online: June 4, 2020
View Articletitled, Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study
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Topics: Design, Diffraction, Diffraction patterns, Optical elements, Lasers, Construction
Journal Articles

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

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J.-B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, F. Dulondel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
https://doi.org/10.1115/1.4042806
Published Online: March 1, 2019
View Articletitled, Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
Open the PDF for Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements in another window
Topics: Manufacturing, Shear stress, Solder joints, Solders, Strain gages, Temperature, Thermomechanics, Cycles, Construction, Shear (Mechanics)
Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

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Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
https://doi.org/10.1115/1.4003217
Published Online: March 3, 2011
View Articletitled, Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection
Journal Articles

Compact Thermal Models: A Global Approach

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Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041107.
https://doi.org/10.1115/1.2993132
Published Online: November 14, 2008
View Articletitled, Compact Thermal Models: A Global Approach
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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

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Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Articletitled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

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Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Articletitled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

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R. G. Ross, Jr., L. C. Wen, G. R. Mon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 165–172.
https://doi.org/10.1115/1.2909313
Published Online: June 1, 1993
View Articletitled, Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
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Topics: Construction, Creep, Relaxation (Physics), Solder joints, Stress, Solders, Stiffness, Complex systems, Cycles, Damage
Journal Articles

Finite Element Modeling for Optimizing Hermetic Package Reliability

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J. H. Lau, L. B. Lian-Mueller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 255–260.
https://doi.org/10.1115/1.3226544
Published Online: December 1, 1989
View Articletitled, Finite Element Modeling for Optimizing Hermetic Package Reliability
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Topics: Finite element analysis, Modeling, Reliability, Design, Microwaves, Construction, Finite element methods, Finite element model, Leakage, Thermal stresses