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Journal Articles
Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041101.
Paper No: EP-19-1128
Published Online: June 4, 2020
Journal Articles
Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
Published Online: March 1, 2019
Journal Articles
Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
Journal Articles
Compact Thermal Models: A Global Approach
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041107.
Published Online: November 14, 2008
Journal Articles
Three-Dimensional Paddle Shift Modeling for IC Packaging
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
Journal Articles
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
Published Online: July 26, 2002
Journal Articles
Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 165–172.
Published Online: June 1, 1993
Journal Articles
Finite Element Modeling for Optimizing Hermetic Package Reliability
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 255–260.
Published Online: December 1, 1989