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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Subhasis Mukherjee, Mohammed Nuhi, Abhijit Dasgupta, Mohammad Modarres

J. Electron. Packag. September 2016, 138(3): 030801.

Paper No: EP-15-1143

DOI: https://doi.org/10.1115/1.4033375

Published Online: June 8, 2016

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Topics: Creep, Solders, Tin, Constitutive equations

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards

J. Electron. Packag. March 2010, 132(1): 011005.

DOI: https://doi.org/10.1115/1.4000754

Published Online: March 4, 2010

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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers

Journal Articles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso

J. Electron. Packag. June 2009, 131(2): 021003.

DOI: https://doi.org/10.1115/1.3103951

Published Online: March 27, 2009

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Topics: Creep, Lead-free solders, Stress, Stress-strain relations, Deformation, Waves, Solders, Simulation, Constitutive equations, Alloys

Journal Articles

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

David M. Pierce, Sheri D. Sheppard, Arlo F. Fossum, Paul T. Vianco, Mike K. Neilsen

J. Electron. Packag. March 2008, 130(1): 011002.

DOI: https://doi.org/10.1115/1.2837513

Published Online: January 31, 2008

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Topics: Constitutive equations, Creep, Damage, Finite element analysis, Plasticity, Simulation, Solders, Temperature, Stress, Fatigue

Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane

J. Electron. Packag. September 2007, 129(3): 278–286.

DOI: https://doi.org/10.1115/1.2753917

Published Online: July 20, 2006

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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation

Journal Articles

Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining

Xianjie Yang, Yan Luo, Qing Gao

J. Electron. Packag. March 2007, 129(1): 41–47.

DOI: https://doi.org/10.1115/1.2429708

Published Online: May 18, 2006

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Topics: Deformation, Modeling, Solders, Stress, Alloys, Tin, Constitutive equations

Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang

J. Electron. Packag. September 2004, 126(3): 367–373.

DOI: https://doi.org/10.1115/1.1773197

Published Online: October 6, 2004

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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys

Journal Articles

A Damage-Mechanics-Based Constitutive Model for Solder Joints

C. Basaran, Y. Zhao, H. Tang, J. Gomez

J. Electron. Packag. September 2005, 127(3): 208–214.

DOI: https://doi.org/10.1115/1.1939822

Published Online: July 23, 2004

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Topics: Constitutive equations, Creep, Damage, Flow (Dynamics), Hardening, Kinematics, Solder joints, Solders, Stress, Temperature

Journal Articles

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

J. Electron. Packag. June 2004, 126(2): 225–231.

DOI: https://doi.org/10.1115/1.1756146

Published Online: July 8, 2004

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Topics: Failure, Solders, Stress, Temperature, Testing, Thermomechanics, Modeling, Electronic packaging, Fracture (Process), Constitutive equations

Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau

J. Electron. Packag. March 2004, 126(1): 148–158.

DOI: https://doi.org/10.1115/1.1649246

Published Online: April 30, 2004

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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis

Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu

J. Electron. Packag. March 2004, 126(1): 100–105.

DOI: https://doi.org/10.1115/1.1648060

Published Online: April 30, 2004

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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement

Journal Articles

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Hong Tang, Cemal Basaran, Mem. ASME, Associate Professor and Director,

J. Electron. Packag. March 2003, 125(1): 120–125.

DOI: https://doi.org/10.1115/1.1536171

Published Online: March 14, 2003

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Topics: Cycles, Damage, Fatigue life, Finite element analysis, Simulation, Solder joints, Solders, Constitutive equations, Fatigue, Ball-Grid-Array packaging

Journal Articles

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Robert Darveaux

J. Electron. Packag. September 2002, 124(3): 147–154.

DOI: https://doi.org/10.1115/1.1413764

Published Online: July 26, 2002

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Topics: Fatigue life, Finite element analysis, Fracture (Materials), Constitutive equations, Solder joints, Simulation, Density

Journal Articles

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian

J. Electron. Packag. June 2002, 124(2): 91–96.

DOI: https://doi.org/10.1115/1.1451845

Published Online: May 2, 2002

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Topics: Constitutive equations, Creep, Deformation, Dislocations, Grain boundaries, Grain size, Solders, Stress tensors, Temperature

Journal Articles

A New Creep Constitutive Model for Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang, Q. J. Yang

J. Electron. Packag. June 2002, 124(2): 85–90.

DOI: https://doi.org/10.1115/1.1462624

Published Online: May 2, 2002

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Topics: Constitutive equations, Creep, Solders, Stress, Temperature

Journal Articles

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,

J. Electron. Packag. March 2002, 124(1): 60–66.

DOI: https://doi.org/10.1115/1.1400752

Published Online: March 15, 2001

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Topics: Constitutive equations, Damage, Fatigue life, Solder joints, Stress, Thermomechanics, Vibration, Finite element analysis, Reliability, Thermal expansion

Journal Articles

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

V. Stolkarts, L. M. Keer, ASME Fellow, M. E. Fine

J. Electron. Packag. December 2001, 123(4): 351–355.

DOI: https://doi.org/10.1115/1.1407825

Published Online: February 23, 2000

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Topics: Cycles, Damage, Solders, Temperature, Fatigue, Simulation, Constitutive equations

Journal Articles

Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

J. Zhu

J. Electron. Packag. December 1999, 121(4): 297–302.

DOI: https://doi.org/10.1115/1.2793856

Published Online: December 1, 1999

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Topics: Ball-Grid-Array packaging, Manufacturing, Microscale devices, Solder joints, Creep, Design, Solders, Cycles, Modeling, Reliability

Journal citation

NARROW

Effective Constitutive Relations for Sintered Nano Copper Joints

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Special Section on InterPACK 2013

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining

Behavior of Lead-Free Solder Under Thermomechanical Loading

A Damage-Mechanics-Based Constitutive Model for Solder Joints

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Failure Analysis of Miniature Solder Specimen

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

A New Creep Constitutive Model for Eutectic Solder Alloy

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

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