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Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

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Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
https://doi.org/10.1115/1.4047459
Published Online: June 23, 2020
View Articletitled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
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Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields
Journal Articles

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

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Sandesh S. Chougule, S. K. Sahu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021004.
Paper No: EP-14-1024
https://doi.org/10.1115/1.4028994
Published Online: June 1, 2015
View Articletitled, Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling
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Topics: Computer cooling, Cooling, Heat pipes, Nanofluids, Phase change materials, Water, Temperature, Paraffin wax, Heating, Test facilities
Journal Articles

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

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Satish G. Kandlikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
https://doi.org/10.1115/1.4027175
Published Online: April 29, 2014
View Articletitled, Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
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Topics: Cooling, Cooling systems, Design, Flow (Dynamics), Heat, Microchannels, Pressure drop, Computer cooling, Temperature, Coolants
Journal Articles

Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes

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Kambiz Jahani, Maziar Mohammadi, Mohammad Behshad Shafii, Zahra Shiee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
https://doi.org/10.1115/1.4023847
Published Online: March 28, 2013
View Articletitled, Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes
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Topics: Computer cooling, Ferrofluids, Fluids, Heat pipes, Heating, Magnetic fields, Nanofluids, Thermal resistance, Water, Heat transfer
Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

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A. F. M. Arif, Syed M. Zubair, S. Pashah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
https://doi.org/10.1115/1.4007258
Published Online: October 30, 2012
View Articletitled, Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives
Journal Articles

Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling

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Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041001.
https://doi.org/10.1115/1.4007159
Published Online: August 29, 2012
View Articletitled, Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling
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Topics: Cooling, Design, Fluids, Optimization, Microchannels, Topology, Heat sinks, Temperature, Computer cooling, Heat transfer
Journal Articles

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

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Peipei Li, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
https://doi.org/10.1115/1.4005297
Published Online: December 9, 2011
View Articletitled, Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal
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Topics: Convection, Cooling, Heat, Liquid metals, Temperature, Thermal resistance, Water, Stress, Coolants, Computer cooling
Journal Articles

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

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David Newport, Colin Forno, Maurice Whelan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031001.
https://doi.org/10.1115/1.4002161
Published Online: September 8, 2010
View Articletitled, Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures
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Topics: Cylinders, Interferometers, Interferometry, Temperature, Flow (Dynamics), Cooling, Thermal conductivity, Natural convection, Computer cooling
Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

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K. Lafdi, O. Mesalhy, A. Elgafy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
https://doi.org/10.1115/1.2912185
Published Online: April 25, 2008
View Articletitled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
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Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity
Journal Articles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

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Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
https://doi.org/10.1115/1.2837524
Published Online: January 31, 2008
View Articletitled, Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
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Topics: Computational fluid dynamics, Cooling, Heat transfer, Natural convection, Temperature, Flow (Dynamics), Thermal resistance, Computer cooling, Simulation
Journal Articles

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

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Kun-Nan Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 449–455.
https://doi.org/10.1115/1.2353281
Published Online: February 15, 2006
View Articletitled, Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components
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Topics: Computer cooling, Cooling, Design, Finite element analysis, Finite element model, Optimization, Printed circuit boards, Screws, Testing, Materials properties
Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

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A. Bhattacharya, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
https://doi.org/10.1115/1.2229225
Published Online: September 23, 2005
View Articletitled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
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Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials
Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

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Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
https://doi.org/10.1115/1.2065727
Published Online: April 20, 2005
View Articletitled, Meso Scale Pulsating Jets for Electronics Cooling
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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling
Journal Articles

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

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Jeffrey Rambo, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 452–459.
https://doi.org/10.1115/1.2056575
Published Online: February 11, 2005
View Articletitled, Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
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Topics: Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat
Journal Articles

Foreword

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Bahgat Sammakia, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
https://doi.org/10.1115/1.1827273
Published Online: January 24, 2005
View Articletitled, Foreword
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Topics: Heat sinks, Packaging, Thermal engineering, Thermal management, Cooling, Computer cooling, Computers, Inventions, Design, Heat transfer
Journal Articles

h adiabatic and u max ′

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Robert J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
https://doi.org/10.1115/1.1827265
Published Online: January 24, 2005
View Articletitled, h adiabatic and u max ′
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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Temperature, Turbulence, Heat transfer coefficients, Heat conduction, Heating, Coolants, Computer cooling
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

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Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Articletitled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

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D. Agonafer, A. Vimba
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 138–143.
https://doi.org/10.1115/1.2792220
Published Online: June 1, 1997
View Articletitled, Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems
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Topics: Computational fluid dynamics, Computer cooling, Solid models, Computer-aided design, Boundary-value problems, Fluids, Geometry, Materials properties, Mesh generation, Turbulence
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

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S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Articletitled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum
Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

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S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 58–63.
https://doi.org/10.1115/1.2792201
Published Online: March 1, 1997
View Articletitled, Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow