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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

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Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Articletitled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

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Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Articletitled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

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Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

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Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Articletitled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

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Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
https://doi.org/10.1115/1.4033165
Published Online: April 19, 2016
View Articletitled, Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging
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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids
Journal Articles

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

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Kenny Mahan, Yong Sun, Bongtae Han, Sungwon Han, Mike Osterman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031004.
Paper No: EP-13-1084
https://doi.org/10.1115/1.4026922
Published Online: May 5, 2014
View Articletitled, Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
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Topics: Adhesion, Coating processes, Coatings, Testing, Urethane elastomers, Pressure
Journal Articles

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

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M. Mastrangeli, K. Jans, T. Steylaerts, C. Van Hoof, J.-P. Celis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041008.
https://doi.org/10.1115/1.4002725
Published Online: November 24, 2010
View Articletitled, Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
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Topics: Coating processes, Coatings, Electronic packaging, Self-assembly, Fluids, Water, Hydrophobicity
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

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Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Articletitled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

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M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Articletitled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

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Mark A. Trautman, Murli Tirumala, S. M. You
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
https://doi.org/10.1115/1.2837509
Published Online: February 4, 2008
View Articletitled, Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
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Topics: Boiling, Coatings, Cooling, Heat, Fluids, Fins, Heat conduction, Coating processes
Journal Articles

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

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Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
https://doi.org/10.1115/1.483152
Published Online: December 29, 1999
View Articletitled, A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
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Topics: Warping, Coating processes, Packaging, Temperature, Shades and shadows, Stainless steel
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

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A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Articletitled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

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T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Articletitled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
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Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses
Journal Articles

Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source

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T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 37–43.
https://doi.org/10.1115/1.2905491
Published Online: March 1, 1994
View Articletitled, Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source
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Topics: Heat, Reliability, Slabs, Coating processes, Coatings, Temperature, Thermal stresses, Stress tensors
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

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J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 233–239.
https://doi.org/10.1115/1.2909323
Published Online: September 1, 1993
View Articletitled, Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests
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Topics: Coating processes, Coatings, Electronic components, Yield stress, Circuits, Die cutting, Flow (Dynamics), Shear stress, Shearing (Deformation)
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

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J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 240–248.
https://doi.org/10.1115/1.2909324
Published Online: September 1, 1993
View Articletitled, Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter
Open the PDF for Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter in another window
Topics: Coating processes, Coatings, Electronic components, Skin, Yield stress, Die cutting, Disperse systems, Electronic circuits, Flow (Dynamics), Shear stress
Journal Articles

Effects of Configuration on Plastic Package Stresses

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L. T. Nguyen, S. A. Gee, W. F. v. d. Bogert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 397–404.
https://doi.org/10.1115/1.2905426
Published Online: December 1, 1991
View Articletitled, Effects of Configuration on Plastic Package Stresses
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Topics: Stress, Coating processes, Coatings, Compressive stress, Molding, Finite element analysis, Silicones, Simulation, Strain gages
Journal Articles

Oil Films on Electroplated Gold Contact Surfaces

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R. G. Bayer, K. M. Conrow, P. A. Lazarou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 236–240.
https://doi.org/10.1115/1.3226539
Published Online: September 1, 1989
View Articletitled, Oil Films on Electroplated Gold Contact Surfaces
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Topics: Coating processes, Coatings, Friction, Lubricants, Metallurgy, Microscopy, Polarization (Light), Shapes, Wear