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Journal Articles

Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

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Meriem Akin, Jennifer Blackburn, Autumn Pratt, Andreas Dietzel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021010.
Paper No: EP-19-1057
https://doi.org/10.1115/1.4046557
Published Online: April 6, 2020
View Articletitled, Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks
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Topics: Chain, Joining, Sensors
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

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Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Articletitled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Open the PDF for Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test in another window
Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

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Tarek Ragab, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020903.
https://doi.org/10.1115/1.4003866
Published Online: June 7, 2011
View Articletitled, The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations
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Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress
Journal Articles

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

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Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna, Martin Gall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
https://doi.org/10.1115/1.2957318
Published Online: July 29, 2008
View Articletitled, A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
Open the PDF for A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method in another window
Topics: Finite element methods, Heat conduction, Metals, Modeling, Simulation, Temperature, Chain, Finite element analysis, Thermal conductivity, Clocks
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

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S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Articletitled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields
Journal Articles

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

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J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
https://doi.org/10.1115/1.2793855
Published Online: December 1, 1999
View Articletitled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
Open the PDF for Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB) in another window
Topics: Copper, Epoxy resins, Lamination, Printed circuit boards, Adhesion, Resins, Plasmas (Ionized gases), Atomic force microscopy, Polymerization, Temperature
Journal Articles

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

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Z. Qian, M. Lu, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 145–149.
https://doi.org/10.1115/1.2792605
Published Online: June 1, 1998
View Articletitled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
Open the PDF for Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity in another window
Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Journal Articles

Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

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Tsung-Yu Pan, Ronald R. Cooper, Howard D. Blair, Thomas J. Whalen, John M. Nicholson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 76–82.
https://doi.org/10.1115/1.2905508
Published Online: June 1, 1994
View Articletitled, Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards
Open the PDF for Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards in another window
Topics: Experimental analysis, Fatigue, Printed circuit boards, Cycles, Design, Electrical resistance, Fracture (Materials), Chain, Cracking (Materials), Electronic packages