1-17 of 17
Capacitors
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Available to Purchase
Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Articletitled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Open the PDF for A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components in another window
Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Available to Purchase
Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Articletitled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Open the PDF for Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions in another window
Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Available to Purchase
Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
https://doi.org/10.1115/1.4042979
Published Online: April 10, 2019
View Articletitled, Reliability Considerations for Oil Immersion-Cooled Data Centers
Open the PDF for Reliability Considerations for Oil Immersion-Cooled Data Centers in another window
Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity
Journal Articles

New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications

Available to Purchase
N. H. Chao, D. E. Carlucci
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021003.
Paper No: EP-18-1047
https://doi.org/10.1115/1.4042471
Published Online: March 1, 2019
View Articletitled, New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications
Open the PDF for New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications in another window
Topics: Electronics, Temperature, Simulation, Capacitors
Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Available to Purchase
Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
https://doi.org/10.1115/1.4039790
Published Online: May 10, 2018
View Articletitled, Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
Open the PDF for Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach in another window
Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Available to Purchase
Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Articletitled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
Open the PDF for Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric in another window
Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

Available to Purchase
B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
View Articletitled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
Open the PDF for Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading in another window
Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

On-Wafer Capacitors Under Mechanical Stress

Available to Purchase
Päivi H. Karjalainen, Pekka Heino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
https://doi.org/10.1115/1.2753918
Published Online: August 24, 2006
View Articletitled, On-Wafer Capacitors Under Mechanical Stress
Open the PDF for On-Wafer Capacitors Under Mechanical Stress in another window
Topics: Capacitors, Semiconductor wafers, Stress, Complementary metal oxide semiconductors
Journal Articles

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

Available to Purchase
S. Chaparala, J. M. Pitarresi, S. Parupalli, S. Mandepudi, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
https://doi.org/10.1115/1.2353280
Published Online: February 23, 2006
View Articletitled, Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
Open the PDF for Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies in another window
Topics: Ball-Grid-Array packaging, Manufacturing, Reliability, Stiffness, Mirrors, Cycles, Solder joints, Solders, Finite element analysis, Capacitors
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Available to Purchase
Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Articletitled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
Open the PDF for Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation in another window
Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Available to Purchase
Swapan K. Bhattacharya, Faculty of Research, Rao R. Tummala, Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
https://doi.org/10.1115/1.1400751
Published Online: January 12, 2001
View Articletitled, Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives
Open the PDF for Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives in another window
Topics: Capacitors, Epoxy adhesives, Epoxy resins, Manufacturing, Nanocomposites, Composite materials, Ceramics, Polymers, Fillers (Materials), Particulate matter
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Available to Purchase
Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Articletitled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
Open the PDF for Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM in another window
Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

A New Method to Determine Crack Shape and Size in Solder Joints

Available to Purchase
T. Reinikainen, F. W. Wulff, W. Kolbe, T. Ahrens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 266–269.
https://doi.org/10.1115/1.2792103
Published Online: December 1, 1995
View Articletitled, A New Method to Determine Crack Shape and Size in Solder Joints
Open the PDF for A New Method to Determine Crack Shape and Size in Solder Joints in another window
Topics: Fracture (Materials), Shapes, Solder joints, Solders, Computer-aided design, Fatigue cracks, Capacitors, Ceramics, Copper, Image processing
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Available to Purchase
Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Articletitled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
Open the PDF for Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints in another window
Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors

Available to Purchase
M. K. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 147–153.
https://doi.org/10.1115/1.2904355
Published Online: June 1, 1990
View Articletitled, Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors
Open the PDF for Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors in another window
Topics: Capacitors, Solder joints, Stress, Design, Rotation, Solders, Ceramics, Manufacturing, Printed circuit boards
Journal Articles

Modeling Thermal Stress Behavior in Microelectronic Components

Available to Purchase
G. C. Scott, G. Astfalk
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 35–40.
https://doi.org/10.1115/1.2904338
Published Online: March 1, 1990
View Articletitled, Modeling Thermal Stress Behavior in Microelectronic Components
Open the PDF for Modeling Thermal Stress Behavior in Microelectronic Components in another window
Topics: Modeling, Thermal stresses, Stress, Failure, Mechanical properties, Thermal stress cracking, Capacitors, Ceramics, Cracking (Materials), Dimensions
Journal Articles

Solder Fillet Height Criteria for Surface Mounted Chip Components

Available to Purchase
A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 299–302.
https://doi.org/10.1115/1.3226551
Published Online: December 1, 1989
View Articletitled, Solder Fillet Height Criteria for Surface Mounted Chip Components
Open the PDF for Solder Fillet Height Criteria for Surface Mounted Chip Components in another window
Topics: Solders, Capacitors, Ceramics, Solder joints, Thermal shock, Cycles, Fracture (Materials), Lumber, Navy, Tantalum