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Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

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Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Articletitled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
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Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

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Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Articletitled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
Open the PDF for Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies in another window
Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

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Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
https://doi.org/10.1115/1.4032345
Published Online: March 10, 2016
View Articletitled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors
Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

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Sami A. Alkharabsheh, Bahgat G. Sammakia, Saurabh K. Shrivastava
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
https://doi.org/10.1115/1.4029344
Published Online: June 1, 2015
View Articletitled, Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment
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Topics: Air flow, Calibration, Computational fluid dynamics, Containment, Data centers, Flow (Dynamics), Leakage, Stress, Temperature, Tiles
Journal Articles

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

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S. Shanmugan, D. Mutharasu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
https://doi.org/10.1115/1.4027379
Published Online: May 12, 2014
View Articletitled, Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
Open the PDF for Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink in another window
Topics: Aluminum, Calibration, Copper, Currents, Heat sinks, Junctions, Light-emitting diodes, Temperature, Thermal resistance, Thin films
Journal Articles

Parameter Calibrations on MOSFET Stress Sensors

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Ren-Tzung Tan, Hsien Chung, Ben-Je Lwo, Chun-Pai Tang, Kun-Fu Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031004.
https://doi.org/10.1115/1.4006888
Published Online: July 18, 2012
View Articletitled, Parameter Calibrations on MOSFET Stress Sensors
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Topics: Calibration, MOSFET transistors, Sensors, Stress, Temperature
Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

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Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
https://doi.org/10.1115/1.2065727
Published Online: April 20, 2005
View Articletitled, Meso Scale Pulsating Jets for Electronics Cooling
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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling
Journal Articles

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

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Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 232–236.
https://doi.org/10.1115/1.1756147
Published Online: July 8, 2004
View Articletitled, Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation
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Topics: Calibration, Modeling, Solders, Temperature, Testing, Finite element analysis, Electronic packaging, Shear (Mechanics), Stress, Boundary-value problems
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

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Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
View Articletitled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

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Ben-Je Lwo, Mem. ASME, Shen-Yu Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 289–293.
https://doi.org/10.1115/1.1572904
Published Online: June 10, 2003
View Articletitled, Calibrate Piezoresistive Stress Sensors Through the Assembled Structure
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Topics: Calibration, Sensors, Stress, Temperature
Journal Articles

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

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Ben-Je Lwo, Tung-Sheng Chen, Ching-Hsing Kao, Yu-Lin Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 115–121.
https://doi.org/10.1115/1.1452244
Published Online: May 2, 2002
View Articletitled, In-Plane Packaging Stress Measurements Through Piezoresistive Sensors
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Topics: Packaging, Sensors, Stress, Calibration, Temperature
Journal Articles

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

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Ben-Je Lwo, Ching-Hsing Kao, Tung-Sheng Chen, Yao-Shing Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 22–26.
https://doi.org/10.1115/1.1414134
Published Online: February 21, 2000
View Articletitled, On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging
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Topics: Calibration, Sensors, Stress, Temperature, Manufacturing, Microelectronic packaging
Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

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Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
https://doi.org/10.1115/1.1285983
Published Online: December 8, 1999
View Articletitled, A Study of Process-Induced Residual Stress in PBGA Packages
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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

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C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 294–300.
https://doi.org/10.1115/1.2792252
Published Online: December 1, 1997
View Articletitled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration
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Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure
Journal Articles

Thermomechanical Modeling of Direct Chip Interconnection Assembly

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E. K. Buratynski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 382–391.
https://doi.org/10.1115/1.2909347
Published Online: December 1, 1993
View Articletitled, Thermomechanical Modeling of Direct Chip Interconnection Assembly
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Topics: Manufacturing, Modeling, Thermomechanics, Anisotropy, Adhesives, Calibration, Hardening (Curing), Stress